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Response Rate
100.0%
Response Time
125.8hours
Product
Multi-chamber sputtering equipment ENTRONTM-EX2 W300Handling Company
ULVAC Sales Co., Ltd.Categories
| Image | Part Number | Price (excluding tax) | Electricity | Film thickness distribution (*1) | Rough pulling | Energy saving function | Purpose | Possible process gas system | Transport system | Transfer robot | Grounding work | Required gas | Board dimensions | Compressed air | Control system | Ultimate pressure | Cooling water | Main exhaust | Module | Process temperature | Pre-clean | Throughput | Spatter | CVD | Option |
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ENTRONTM-EX2 W300 (Tandem) |
Available upon quote |
50Hz/60Hz, 3φ, 200V |
Inside φ300 board/within ±5% |
Roughing dry pump, TMP fore dry pump |
Standard equipment |
Memory, non-volatile memory, logic |
PVD: Up to 4 systems |
Atmospheric wafer transfer machine |
Dual arm high vacuum transfer robot x 2 |
Class A |
Various process gases: 0.1~0.3MPa |
Compatible with φ300mm |
0.5~0.7MPa |
FA-PC control (Cluster tool controller) |
Transfer room: 3.0E-6Pa or less |
0.3~0.5MPa, temperature 20~25℃ |
LL chamber: Turbo molecular pump |
L/UL chamber x 2 + maximum 8 process chambers |
R.T~450℃ |
ICP etching, hydrogen annealing, CDT |
Mechanical throughput: 160wph (transferred twice) |
Sputter-down method/rotating magnet cathode: conventional, LTS, SIS, HiCIS, multi-cathode |
FEOL, BEOL, CVD for NVM, ALD, etc. |
LTS/SIS/multi-cathode/CVD/ALD module selection available |
Reviews shown here are reviews of companies.
Reviews shown here are reviews of companies.
Response Rate
100.0%
Response Time
125.8hrs
