Submicron 3D X-ray CA20 for Advanced Packaging
Cosmo Trading Co., Ltd.
About This Product
The CA20 is designed to deliver superior 2D and 3D images at the highest resolution, enabling the fastest inspection of micron-sized details and reducing time to market for complex 3D ICs. can.
■Highlights of CA20
・Designed for the semiconductor industry
・Non-destructive technology that grasps solder bumps three-dimensionally within minutes
- Highly reproducible results with reliable and accurate technology designed to support stable testing routines
・Efficient software-assisted reviews including automated void analysis with Void Insights
・Dose Manager protects components sensitive to X-rays
■CA20 – The fastest way from R&D to ROI
The semiconductor sector is an industry that demands speed. In the race for technological innovation, every day counts. As an inspection system developed specifically for complex 3D IC challenges in Advanced Packaging, the CA20 helps you keep pace and stay ahead of the competition. CA20 enables accelerated validation of new packaging process node prototypes.
The sooner you find and resolve the root cause of your startup problems, the faster you can reach your desired yield and therefore return on investment (ROI).
■Speed up process development with 3D X-rays
Unlike destructive inspections that can take weeks, 3D X-ray inspection provides results that R&D engineers can use right away. As a non-destructive testing (NDT) system, the CA20 provides nano-level clear 3D images inside ICs in minutes. Monitor your interconnection processes, quickly find defects, and feed your findings back into the process.
■Identification of critical defects in Advanced Packaging
3D X-ray produces high-resolution 3D volumes that allow manufacturers to measure and inspect bumps and identify the smallest defects in record time. Monitor die tilt and warpage like never before by checking for critical defects such as non-wetting, head-in-pillow, and bump shift, and determining standoff height.
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Product
Submicron 3D X-ray CA20 for Advanced Packaging
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Handling Company
Cosmo Trading Co., Ltd.
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Categories
1 Models of Submicron 3D X-ray CA20 for Advanced Packaging
| Product Image | Part Number | Price (excluding tax) | Defect size | Industry | Operating mode | Parts size |
|---|---|---|---|---|---|---|
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CA20 |
Available upon quote | <1 µm, <50 µm, <1 mm | Advanced Packaging, Semiconductors, Electronics, Science & Research | 3D X-ray, 2D/3D | <435 mm |
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About Company Handling This Product
- Japan