■About powder sputtering equipment
In recent years, there has been an active movement to improve the performance, safety, and cost reduction of secondary batteries such as lithium-ion batteries and fuel cells, and the performance is improved by forming a film on the fine particles that are the raw material for secondary batteries. approaches are being taken. Dry methods such as sputtering are considered advantageous for forming films of various materials with high purity, and are widely used for forming films on flat plates.
On the other hand, in order to uniformly form a film on fine particles, fine particle dispersion is required, but it has been considered technically difficult to do so using a dry process. For this reason, until now there was no way to take advantage of the advantages of the dry process, such as flexibility in materials, high purity of the deposited material, and no waste liquid, for film deposition on fine particles.
This device uses a unique stirring mechanism to achieve good dispersion of fine particles in a dry process, and achieves uniform film formation on fine particles that takes advantage of the characteristics of a dry process.
■What is powder sputtering equipment?
This is a device that coats the surface of powder with a diameter of up to several micrometers with a thin film using vacuum and plasma. It is expected to be applied to preventing the deterioration of powder materials, controlling the electrical conductivity of powder surfaces, and saving resources by making thin films of rare materials.
■Characteristics of powder sputtering equipment
・Uniform film formation using stirring mechanism. Stirring is achieved by swinging the container (barrel) containing the powder and swinging the arm.
・No chemical reaction required; film is formed in vacuum, solving the problems of wet methods
・Film formation with high purity and high adhesion High degree of freedom in combination of thin film and powder materials
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