A flexible solution for RIE processes in a compact footprint and open load system PlasmaPro 800 RIE
Oxford Instruments Ltd.
About This Product
■Summary
The PlasmaPro 800 RIE provides a flexible solution for reactive ion etching (RIE) processes for large wafer batches and 300mm wafers in a compact footprint and open load system.
A large wafer table enables production-level batch processing and handling of 300mm wafers.
Provides maximum process flexibility in compound semiconductor, optoelectronics, and photonics applications.
■Features
・High performance process
・Excellent substrate temperature control
・High precision process control
・Proven 300mm single wafer failure analysis process
・Large electrode: low cost of ownership
・Etching Endpoint detection: Reliability and serviceability
- Endpoint detection by laser interferometry and/or emission spectroscopy: can also be installed to enhance etch control
・4-, 8- or 12-line gas pod options: Flexible process and process gas options, allowing installation in service areas away from regular process tools
・Closed couple turbo pump: high pumping speed and excellent base pressure
・Data logger: Acquisition of traceability and history of chamber and process conditions
・Liquid-cooled or electrically heated electrodes: excellent electrode temperature control and stability
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Product
A flexible solution for RIE processes in a compact footprint and open load system PlasmaPro 800 RIE
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Handling Company
Oxford Instruments Ltd.
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Categories
1 Models of A flexible solution for RIE processes in a compact footprint and open load system PlasmaPro 800 RIE
| Product Image | Part Number | Price (excluding tax) |
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PlasmaPro 800 RIE |
Available upon quote |
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About Company Handling This Product
- Japan