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  4. PlasmaPro 80 RIE provides versatile etch and deposition solutions with an easy-to-use atmospheric charging method (Oxford Instruments Ltd.)
PlasmaPro 80 RIE provides versatile etch and deposition solutions with an easy-to-use atmospheric charging method-PlasmaPro 80 RIE
PlasmaPro 80 RIE provides versatile etch and deposition solutions with an easy-to-use atmospheric charging method-Oxford Instruments Ltd.

PlasmaPro 80 RIE provides versatile etch and deposition solutions with an easy-to-use atmospheric charging method
Oxford Instruments Ltd.

Oxford Instruments Ltd.'s Response Status

Response Rate

100.0%

Response Time

26.3hours

Relatively Fast Response

About This Product

■Summary

PlasmaPro 80 Reactive Ion Etching (RIE) is a compact, space-saving system that provides a variety of etch and deposition solutions with an easy-to-use atmospheric loading method. It is easy to install and use, yet the quality of the process remains the same. The atmospheric charging design allows for rapid wafer loading and extraction, making it ideal for research, prototyping, and low-volume production. Optimized electrode cooling and superior substrate temperature control enable high-performance processes.

■Features

・Atmospheric charging design allows for rapid wafer loading and extraction ・Excellent etching control and optimum etching speed possible ・Achieves excellent wafer temperature uniformity ・Can process wafers up to 200mm ・Low cost of ownership ・Compliant with safety guidelines Semi S2/S8 standards

■System features

・Compact: Easy to install ・Optimized electrode cooling function: substrate temperature control - High conductance radial (axisymmetric) pump: guarantees greater process uniformity and speed ・Data logger function of 500ms or less: Traceability and history of chamber and process conditions can be recorded. ・Close coupling turbo pump: high pump speed and excellent base pressure ・Clear accessibility to major parts: improved serviceability and maintainability ・X20 Control System: Significantly improves data searchability and achieves faster and more reproducible matching ・Front-end software diagnosis of faults and tools: rapid fault diagnosis ・Laser endpoint detection using interferometers: Measure the etching depth of transparent materials (such as oxides on Si) on reflective surfaces or measure the reflectance of opaque materials (such as metals) to detect layer boundaries. decide - Optical emission spectroscopy (OES) for endpoint measurements in large sample volumes or batch processes: detects changes in etching byproducts and depletion of reactive gas species, and is used for endpoint measurements in chamber cleaning.

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    PlasmaPro 80 RIE provides versatile etch and deposition solutions with an easy-to-use atmospheric charging method

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1 Models of PlasmaPro 80 RIE provides versatile etch and deposition solutions with an easy-to-use atmospheric charging method

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PlasmaPro 80 RIE provides versatile etch and deposition solutions with an easy-to-use atmospheric charging method-Part Number-PlasmaPro 80 RIE

PlasmaPro 80 RIE

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About Company Handling This Product

Oxford Instruments Ltd.

Response Rate

100.0%

Response Time

26.3hrs

  • Japan

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