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  4. Compact and versatile etch and deposition solution PlasmaPro 80 PECVD (Oxford Instruments Ltd.)
Compact and versatile etch and deposition solution PlasmaPro 80 PECVD-PlasmaPro 80 PECVD
Compact and versatile etch and deposition solution PlasmaPro 80 PECVD-Oxford Instruments Ltd.

Compact and versatile etch and deposition solution PlasmaPro 80 PECVD
Oxford Instruments Ltd.

Oxford Instruments Ltd.'s Response Status

Response Rate

100.0%

Response Time

24.8hours

Company Review

5.0

Relatively Fast Response

About This Product

The PlasmaPro 80 is a compact, space-saving system that provides versatile etch and deposition solutions in an easy-to-use, open-load format. This open-load method is easy to install and use and does not compromise process quality. It also allows for rapid wafer loading and unloading, making it an ideal system for research, prototyping, and low-volume production. Optimized electrode cooling and superior substrate temperature control enable high-performance processes.

■Features

・Open load design allows for quick wafer installation and removal ・Achieves excellent etching control and optimal etching speed ・Achieves excellent wafer temperature uniformity ・Wafer size up to 200mm ・Low cost of ownership ・Compliant with safety guidelines Semi S2/S8 standards

■System features

・Compact: Easy to install ・Optimized electrode cooling function: substrate temperature control ・Uses a high-conductance radial (axisymmetric) pump: Improves process uniformity and increases etching speed ・Data logger function of 500ms or less: Traceability and history of chamber and process conditions can be recorded. ・Close coupling turbo pump: high pump speed and excellent base pressure ・Clear accessibility to major parts: improved serviceability and maintainability ・X20 Control System: Significantly improves data searchability and achieves faster and more reproducible matching ・Front-end software-based fault diagnosis and tool diagnosis: Rapid fault diagnosis ・Laser endpoint detection using interferometers: Measuring the etching depth of transparent materials on reflective surfaces (e.g. oxides on Si) or determining layer boundaries by measuring the reflectance of non-transparent materials (e.g. metals) ・Optical emission spectroscopy (OES) for endpoint measurements in large sample volumes or batch processes: detects changes in etching byproducts and depletion of reactive gas species, and is used for endpoint measurements in chamber cleaning

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    Compact and versatile etch and deposition solution PlasmaPro 80 PECVD

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1 Models of Compact and versatile etch and deposition solution PlasmaPro 80 PECVD

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Compact and versatile etch and deposition solution PlasmaPro 80 PECVD-Part Number-PlasmaPro 80 PECVD

PlasmaPro 80 PECVD

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About Company Handling This Product

Oxford Instruments Ltd.

Response Rate

100.0%

Response Time

24.8hrs

Company Review

5.0
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