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Wafer automatic peeling equipment (peeling cleaning machine) PWD2020-PWD2020
Wafer automatic peeling equipment (peeling cleaning machine) PWD2020-PHT Co., Ltd.

Wafer automatic peeling equipment (peeling cleaning machine) PWD2020
PHT Co., Ltd.

💻 Electronics & Electrical Use

About This Product

PHT will be active in the semiconductor industry as a niche top company in automatic wafer stripping equipment (peeling and cleaning machines) around the world. We have a good track record of shipments for silicon wafers, and can also handle silicon carbide (SiC). Semiconductor manufacturing requires high-speed transport in an extremely clean environment.The automatic wafer peeling equipment used in our semiconductor processing equipment has also been developed ahead of other companies to meet these demands. Its high reliability and productivity have been highly evaluated by customers around the world. As a state-of-the-art industry standard device, it continues to evolve to meet cutting-edge technology and diverse needs. This device is an automatic wafer stripping device (peeling cleaning machine) after wire sawing (slicing). By setting the ingot bonded to the plate jig on the input side, it is a fully automatic system that performs rough cleaning, wafer peeling, single wafer cleaning, drying, and cassette storage. The plate jig after peeling is discharged to the unloader side.  Peeling is done one by one using a hot air heating method. After stripping, the wafers are cleaned using a single-wafer method. Cleaning involves two-fluid high-pressure cleaning, scrub cleaning, rinsing, water absorption roller drying, and slit nozzle drying, after which each sheet is stored in a cassette in the unloader section using a horizontal articulated robot. You can choose to store the cassettes (25 pieces) in the upper or lower tier. Maximum of 6 storage cassettes.   Compatible with OHT transportation.

  • Product

    Wafer automatic peeling equipment (peeling cleaning machine) PWD2020
  • Usage Scenarios

    Electronics & Electrical Use

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1 Models of Wafer automatic peeling equipment (peeling cleaning machine) PWD2020

Image Part Number Price (excluding tax) Plate jig Storage Storage cassette Safety mechanism Compatible sizes Equipment weight Power supply Drive method Option
Wafer automatic peeling equipment (peeling cleaning machine) PWD2020-Part Number-PWD2020

PWD2020

Available upon quote

Made by NTC/MB

Cassette (25 pieces)

Up to 6 pieces

Cassette presence, wafer presence, overload detection, abnormality alarm, emergency stop

Φ12″

Approximately 5,000kg

AC200V, 100A

Motor drive (servo)

Loader part ID reader, unloader part RFID, wafer reversal, storage in multiple cassettes, area sensor, etc.

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