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Product
Thermosetting Adhesive for Reflow Soldering and Self-Alignment JU-R4SHandling Company
KOKI Company Ltd.Categories
Usage Scenarios
Electronics & Electrical Use| Image | Part Number | Price (excluding tax) | Tg (°C) | Appearance and Color | Curing Conditions | Viscosity (Pa.s) | Composition |
|---|---|---|---|---|---|---|---|
|
JU-R4S |
Available upon quote |
59.5 |
Paste, red |
>220°C,>30sec. |
50 |
Epoxy resin |
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Reviews shown here are reviews of companies.