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  4. Thermosetting Adhesive for High-Density Dispensing JU-110-3 (KOKI Company Ltd.)
Thermosetting Adhesive for High-Density Dispensing JU-110-3-JU-110-3
Thermosetting Adhesive for High-Density Dispensing JU-110-3-KOKI Company Ltd.

Thermosetting Adhesive for High-Density Dispensing JU-110-3
KOKI Company Ltd.

💻 Electronics & Electrical Use

About This Product

A high-density dispensing type that can be used even for the temporary fixing of 1005-size chips. It has excellent shape retention, producing tall application shapes continuously and stably.

■A stable application shape that makes reliable contact even with 1005-size components

It has excellent shape retention, producing tall application shapes continuously and stably. As a result, it contacts surface-mount components of every shape, making flow mounting of surface-mount components more reliable.

■Stands up to heat

JU-110-3 has high resistance to heat sag and maintains its applied height to the end. Because it holds its height firmly even during heating and stays in contact with the surface-mount component, it fixes components dependably.

■Compliant with REACH

It is a REACH-compliant product that does not use bisphenol A, an SVHC (substance of very high concern) defined by REACH, the European regulation on chemical substances.

  • Product

    Thermosetting Adhesive for High-Density Dispensing JU-110-3

  • Usage Scenarios

    Electronics & Electrical Use

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1 Models of Thermosetting Adhesive for High-Density Dispensing JU-110-3

Image Part Number Price (excluding tax) Tg (°C) Appearance and Color Curing Conditions Viscosity (Pa.s) Composition
Thermosetting Adhesive for High-Density Dispensing JU-110-3-Part Number-JU-110-3

JU-110-3

Available upon quote

90

Paste, red

130°C, >60sec.

60

Epoxy resin

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About Company Handling This Product

KOKI Company Ltd.

Company Overview

KOKI Company Limited, established in 1952, is a Japan-based manufacturer of soldering materials for the electr...

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  • Japan

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