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XCSW compounds / semiconductor crystals CZ method SiliconwehaHandling Company
Tours Co., Ltd.Categories
Click on the part number for more information about each product
Image | Part Number | Price (excluding tax) | Training method | Conductive | Direction | φ diameter (inch) | Resistance value (Ω ・ cm) | diameter | thickness | Primary flat length | Primary flat oriented | Secondary flat length | Secondary flat direction | TTV | BOW | Warp | Surface finishing | LPD | Back | Chipping |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
CZ-Si |
Available upon quote |
Cz |
N or p |
<100>, <110>, <111> |
3 ~ 8 |
> 1 ~ 300 |
76.2 ~ 200mm |
160 or more |
57.5 ± 2.5mm |
<001> ± 1 ° |
none |
none |
≦ 5 um |
≦ 40um |
≦ 40um |
Chemical mechanical polishing |
≧ 0.3um at ≦ 15pcs |
Etched |
none |
|
MCZ-SI |
Available upon quote |
Mcz |
N or p |
<100>, <110>, <111> |
3 ~ 8 |
> 1 ~ 300 |
76.2 ~ 200mm |
160 or more |
57.5 ± 2.5mm |
<001> ± 1 ° |
none |
none |
≦ 5 um |
≦ 40um |
≦ 40um |
Chemical mechanical polishing |
≧ 0.3um at ≦ 15pcs |
Etched |
none |
|
High concentration CZ-Si |
Available upon quote |
High concentration CZ |
N or p |
<100>, <110>, <111> |
3 ~ 8 |
> 0.001 ~ 1 |
76.2 ~ 200mm |
160 or more |
57.5 ± 2.5mm |
<001> ± 1 ° |
none |
none |
≦ 5 um |
≦ 40um |
≦ 40um |
Chemical mechanical polishing |
≧ 0.3um at ≦ 15pcs |
Etched |
none |
Click on the part number for more information about each product
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