Product
XCSW compounds / semiconductor crystals CZ method SiliconwehaHandling Company
Tours Co., Ltd.Items marked with have different values depending on the model number.
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Product Image | Part Number | Price (excluding tax) | BOW | Back | Chipping | Conductive | Direction | LPD | Primary flat length | Primary flat oriented | Resistance value (Ω ・ cm) | Secondary flat direction | Secondary flat length | Surface finishing | TTV | Training method | Warp | diameter | thickness | φ diameter (inch) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
CZ-Si |
Available upon quote | ≦ 40um | Etched | none | N or p | <100>, <110>, <111> | ≧ 0.3um at ≦ 15pcs | 57.5 ± 2.5mm | <001> ± 1 ° | > 1 ~ 300 | none | none | Chemical mechanical polishing | ≦ 5 um | Cz | ≦ 40um | 76.2 ~ 200mm | 160 or more | 3 ~ 8 | |
MCZ-SI |
Available upon quote | ≦ 40um | Etched | none | N or p | <100>, <110>, <111> | ≧ 0.3um at ≦ 15pcs | 57.5 ± 2.5mm | <001> ± 1 ° | > 1 ~ 300 | none | none | Chemical mechanical polishing | ≦ 5 um | Mcz | ≦ 40um | 76.2 ~ 200mm | 160 or more | 3 ~ 8 | |
High concentration CZ-Si |
Available upon quote | ≦ 40um | Etched | none | N or p | <100>, <110>, <111> | ≧ 0.3um at ≦ 15pcs | 57.5 ± 2.5mm | <001> ± 1 ° | > 0.001 ~ 1 | none | none | Chemical mechanical polishing | ≦ 5 um | High concentration CZ | ≦ 40um | 76.2 ~ 200mm | 160 or more | 3 ~ 8 |
Click on the part number for more information about each product