Product
XCSW compound / semiconductor crystal FZ method SiliconwehaHandling Company
Tours Co., Ltd.Items marked with have different values depending on the model number.
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Product Image | Part Number | Price (excluding tax) | BOW | Back | Chipping | Conductive | Direction | LPD | Primary flat length | Primary flat oriented | Resistance value (Ω ・ cm) | Secondary flat direction | Secondary flat length | Surface finishing | TTV | Training method | Warp | diameter | thickness | φ diameter (inch) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
FZ-Si |
Available upon quote | ≦ 40um | Etched | none | N or p | <100> or <111> | ≧ 0.3um at ≦ 15pcs | 57.5 ± 2.5mm | <001> ± 1 ° | > 1,000 | none | none | Chemical mechanical polishing | ≦ 5 um | Fz | ≦ 40um | 150 ± 0.5mm | 675 ± 15um | 3 ~ 8 | |
NTDFZ-SI |
Available upon quote | ≦ 40um | Etched | none | N | <100> or <111> | ≧ 0.3um at ≦ 15pcs | 57.5 ± 2.5mm | <001> ± 1 ° | 30-800 | none | none | Chemical mechanical polishing | ≦ 5 um | NTDFZ | ≦ 40um | 150 ± 0.5mm | 675 ± 15um | 3 ~ 8 | |
Gdfz-si |
Available upon quote | ≦ 40um | Etched | none | N or p | <100> or <111> | ≧ 0.3um at ≦ 15pcs | 57.5 ± 2.5mm | <001> ± 1 ° | 0.001 ~ 300 | none | none | Chemical mechanical polishing | ≦ 5 um | Gdfz | ≦ 40um | 150 ± 0.5mm | 675 ± 15um | 3 ~ 8 |
Click on the part number for more information about each product