Price (excluding tax)
Using a special doping device, it can be added to high concentrations such as P, SB, AS, and a very low resistance rate can be produced. It is mainly used as an epitaxical growth base.
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BOW
Back
Chipping
Conductive
Direction
LPD
Primary flat length
Primary flat oriented
Resistance value (Ω ・ cm)
Secondary flat direction
Secondary flat length
Surface finishing
TTV
Training method
Warp
diameter
thickness
φ diameter (inch)
Part Number
High concentration CZ-SiHandling Company
Tours Co., Ltd.Items marked with have different values depending on the model number.
Product Image | Price (excluding tax) | BOW | Back | Chipping | Conductive | Direction | LPD | Primary flat length | Primary flat oriented | Resistance value (Ω ・ cm) | Secondary flat direction | Secondary flat length | Surface finishing | TTV | Training method | Warp | diameter | thickness | φ diameter (inch) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Available upon quote | ≦ 40um | Etched | none | N or p | <100>, <110>, <111> | ≧ 0.3um at ≦ 15pcs | 57.5 ± 2.5mm | <001> ± 1 ° | > 0.001 ~ 1 | none | none | Chemical mechanical polishing | ≦ 5 um | High concentration CZ | ≦ 40um | 76.2 ~ 200mm | 160 or more | 3 ~ 8 |