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IGBT Module joining device (Ultrasonic Metal Bonder)-IGBT module joining device
IGBT Module joining device (Ultrasonic Metal Bonder)-Adwells Co., Ltd.

IGBT Module joining device (Ultrasonic Metal Bonder)
Adwells Co., Ltd.

Adwells Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

126.6hours


About This Product

Ultrasonic joining system ideal for power device production ・ Flexible production ・ Resistant to terminal floating ・ Color image processing

■ Same species / hydrophiled metal joining

Difficult metal joining is possible with normal welding. The materials are directly joined at room temperature without using soldering.

■ IGBT module (terminal joining)

In the IGBT module where the operating temperature rises, it is desirable to do not use soldering. By ultrasound, the package side lead and the DBC substrate electrode are directly joined.

  • Product

    IGBT Module joining device (Ultrasonic Metal Bonder)

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1 Models of IGBT Module joining device (Ultrasonic Metal Bonder)

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IGBT Module joining device (Ultrasonic Metal Bonder)-Part Number-IGBT module joining device

IGBT module joining device

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About Company Handling This Product

Response Rate

100.0%


Response Time

126.6hrs

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