Ideal for polishing electronic materials such as SIC wafers chemical liquid
Musashino Denshi, INC.
About This Product
When performing polishing, it is important to select an abrasive that is suitable for samples. When handling a sample that responds to water, it is used by mixing oily abrasives and polished abrasive grains and lubricating oil. When the polishing surface is made a mirror finish, polish it using a CMP abrasive.
In this way, we propose the best abrasive for the sample ingredients and the finishing goals of the polishing surface. It is possible to remove the distortion of the sample, the deterioration layer, and the fine scratch scratch. Ideal for polishing electronic materials such as SIC wafers.
■ Features
・ SIO2 (silicon dioxide) and H2O (water) are the main ingredients for CMP.
・ Finish polishing work is possible with a 0.04 μm (40 nm) abrasive grain.
・ Ideal for CMP polishing of electronic materials such as SIC wafers.
■ Use
・ Gallium oxide (GA2O3)
・ Calcium fluff (CAF2)
・ Germanium Acids (Bi4ge3O12)
・ Lithium tantalate (Lita3)
・ Lithium niovate (Linbo3)
·sapphire
・ Glass
・ Ceramics ... etc.
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Product
Ideal for polishing electronic materials such as SIC wafers chemical liquid
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Handling Company
Musashino Denshi, INC.
1 Models of Ideal for polishing electronic materials such as SIC wafers chemical liquid
| Product Image | Part Number | Price (excluding tax) | Particle size | capacity | pH value |
|---|---|---|---|---|---|
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Chemical liquid |
Available upon quote | 0.04μm | 4L, 1L | Ten |
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About Company Handling This Product
- Japan
- Since 1977