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Achieving an excellent polishing surface CMP pad / IC1000 ™-CMP Pad / IC1000 ™
Achieving an excellent polishing surface CMP pad / IC1000 ™-Musashino Denshi, INC.

Achieving an excellent polishing surface CMP pad / IC1000 ™
Musashino Denshi, INC.

About This Product

■ Polishing supplies used in the CMP (scientific mechanical polishing) process ・ By applying it on an aluminum board (with a brim), it is possible to polish in the liquid on the board filled with a CMP solution. ・ By pasting on a flat aluminum board, you can polish by dropping the CMP solution. It is possible to remove fine scratches that could not be removed by polishing cloth, etc. ・ It is a urethane pad for CMP polishing. The special structure is uniformly spread to the abrasive to achieve an excellent polishing surface. ■ Features ・ Suitable for CMP (Chemical Mechanical Polishing) process. ・ It is a special polyurethane pad with a high -uniform micro foam structure. ・ The abrasive is uniformly spread to achieve an excellent polishing surface. ・ It has both high step easing performance and low scratch performance. ■ CMP Pad / IC1000 ™ application ・ CMP polishing of device wafer insulation film ・ Metal wiring CMP polishing ・ Compound infrastructure such as GAN, SIC, etc.

  • Product

    Achieving an excellent polishing surface CMP pad / IC1000 ™



*Please note that we may not be able to accommodate sample requests.

1 Models of Achieving an excellent polishing surface CMP pad / IC1000 ™

Product Image Part Number Price (excluding tax) Abrasive Compression rate Granularity Hardness (D) Material Outer diameter Process density quantity thickness
Achieving an excellent polishing surface CMP pad / IC1000 ™-Part Number-CMP Pad / IC1000 ™

CMP Pad / IC1000 ™

Available upon quote Coloidal silica abrasive, chemical liquid ... etc. 0.5% - 0.015μm ~ 0.0825μm 52 - Special polyurethane Φ150mm, φ200mm, φ300mm, φ381mm CMP polishing 0.77g/cm3 - 5 sheets/equation 1.17mm -

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About Company Handling This Product

Musashino Denshi, INC.

  • Japan
  • Since 1977

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