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Achieving an excellent polishing surface CMP pad / IC1000 ™Handling Company
Musashino Denshi, INC.Image | Part Number | Price (excluding tax) | Material | Outer diameter | quantity | thickness | Compression rate | density | Hardness (D) | Abrasive | Granularity | Process |
---|---|---|---|---|---|---|---|---|---|---|---|---|
CMP Pad / IC1000 ™ |
Available upon quote |
Special polyurethane |
Φ150mm, φ200mm, φ300mm, φ381mm |
5 sheets/equation |
1.17mm - |
0.5% - |
0.77g/cm3 - |
52 - |
Coloidal silica abrasive, chemical liquid ... etc. |
0.015μm ~ 0.0825μm |
CMP polishing |
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