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Highly durable abrasive diamond baking disc-SDC
Highly durable abrasive diamond baking disc-Musashino Denshi, INC.

Highly durable abrasive diamond baking disc
Musashino Denshi, INC.

Musashino Denshi, INC.'s Response Status

Response Rate

100.0%

Response Time

4.6hours

Very Fast Response


About This Product

■ Overview

High polishing power due to diamond abrasive grain. It is the best abrasive for preliminary polishing (surface processing process). It is an abrasive with a diamond fixed with resin bond. Suitable for use in preliminary polishing (chafing process) before finishing polishing. It is more durable than water -resistant grinding paper and can be used until the diamond layer is gone.

■ Features

・ You can select the particle size size from#80th to#4000 rank according to the application. ・ It is more durable than water -resistant grinding paper and can be used until the diamond layer is gone. ・ The polishing efficiency is restored by removing the polished scraps remaining on the board with the attached alumina whetstone. ・ It is also suitable for the target process for the purpose of aligning the height of the processing surface, such as when polishing multiple samples at the same time. ・ It is also effective for polishing sapphire and ceramics.

■ Use

·sapphire ·Metal material ・ Ceramics ・ Composite materials ... etc.

  • Product

    Highly durable abrasive diamond baking disc

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1 Models of Highly durable abrasive diamond baking disc

Image Part Number Price (excluding tax) Material size Granularity Abrasive Process
Highly durable abrasive diamond baking disc-Part Number-SDC

SDC

Available upon quote

Diamond Resin Bond

Φ150mm, φ200mm, φ300mm, φ381mm

#80 ~ #4000

Distilled water (or OS oil)

Preliminary polishing

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About Company Handling This Product

Response Rate

100.0%


Response Time

4.6hrs

Company Overview

Musashino Denshi, INC., established in 1977 and based in Japan, is a manufacturer of grinding and polishing ma...

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  • Japan

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