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  2. Place multiple molds at the same time Half -curing wrapping wrapping resin vacuum impregnable device (Musashino Denshi, INC.)


Place multiple molds at the same time Half -curing wrapping wrapping resin vacuum impregnable device-Vacuum impregnant device
Place multiple molds at the same time Half -curing wrapping wrapping resin vacuum impregnable device-Musashino Denshi, INC.

Place multiple molds at the same time Half -curing wrapping wrapping resin vacuum impregnable device
Musashino Denshi, INC.

About This Product

A vacuum impregnation device developed for wrapping with epoxy resin. Multiple embedded resin molds can be placed and hardened. ■ Features ・ A vacuum impregnation device specially developed for epoxy resin such as technobit EPOX. ・ A container with embedded mold and epoxy resin with a sample glued inside the device are installed, and the resin can be poured into the mold while vacuuming. ・ Six molds (φ25mm, φ30mm, φ40mm) can be placed at the same time and hardened.

  • Product

    Place multiple molds at the same time Half -curing wrapping wrapping resin vacuum impregnable device



*Please note that we may not be able to accommodate sample requests.

1 Models of Place multiple molds at the same time Half -curing wrapping wrapping resin vacuum impregnable device

Product Image Part Number Price (excluding tax) Body dimensions Built -in mold number φ25mm Built -in mold number φ30mm Built -in mold number φ40mm Rotation board dimensions
Place multiple molds at the same time Half -curing wrapping wrapping resin vacuum impregnable device-Part Number-Vacuum impregnant device

Vacuum impregnant device

Available upon quote W360mm x D350mm x H270mm 6 6 6 Φ200mm

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About Company Handling This Product

Musashino Denshi, INC.

  • Japan
  • Since 1977

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