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Precision polishing system custom polishing device SI wafer electrolytic polishing system-Siwafer electrolytic polishing system
Precision polishing system custom polishing device SI wafer electrolytic polishing system-Musashino Denshi, INC.

Precision polishing system custom polishing device SI wafer electrolytic polishing system
Musashino Denshi, INC.

About This Product

Custom attachment for electrolytic polishing. It was designed to electrolytically polished SI wafers. ■ Characteristics It can be mounted on the precision polishing device of the E type (MA-200E, MA-300E, MA-400E).

  • Product

    Precision polishing system custom polishing device SI wafer electrolytic polishing system



*Please note that we may not be able to accommodate sample requests.

1 Models of Precision polishing system custom polishing device SI wafer electrolytic polishing system

Product Image Part Number Price (excluding tax) Compatible polishing device Digital pressure gauge Pressure gauge Regulator Theoretical thrust cylinder
Precision polishing system custom polishing device SI wafer electrolytic polishing system-Part Number-Siwafer electrolytic polishing system

Siwafer electrolytic polishing system

Available upon quote MA-200E, MA-300E, MA-400E Accuracy: 10g Digital
0.001 ~ 1.0
Resolution: 0.001
Accuracy: 0.01 		Precision: 0.05 ~ 0.8
Sensitivity: 0.0016
Repeated accuracy: 0.004 		0.16kgp ~ 16.0kgp Low friction specification: φ16mm 0.005 ~ 0.5
Ultra -low friction specification: φ20mm 0.05 ~ 0.5

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About Company Handling This Product

Musashino Denshi, INC.

  • Japan
  • Since 1977

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