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  3. Atmospheric pressure plasma device
  4. Attotive pressure (direct) Attotive pressure liquid powder plasma processing device full-scale research PPU-800 (SAKIGAKE-Semiconductor)
Attotive pressure (direct) Attotive pressure liquid powder plasma processing device full-scale research PPU-800-PPU-800
Attotive pressure (direct) Attotive pressure liquid powder plasma processing device full-scale research PPU-800-SAKIGAKE-Semiconductor

Attotive pressure (direct) Attotive pressure liquid powder plasma processing device full-scale research PPU-800
SAKIGAKE-Semiconductor

SAKIGAKE-Semiconductor's Response Status

Response Rate

100.0%

Response Time

120.0hours

About This Product

The powder does not scatter because it is a windless treatment. Mix the flour that was not mixed with the liquid. Promotes aggregation of difficult formation and makes it easier to process.

■ Product overview

･ Carbon powder such as carbon nanotube ･ Paints of water -soluble ink ･ Filler preprocessing ･ Preparing for firing powder ･ Development of hybrid material

  • Product

    Attotive pressure (direct) Attotive pressure liquid powder plasma processing device full-scale research PPU-800

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1 Models of Attotive pressure (direct) Attotive pressure liquid powder plasma processing device full-scale research PPU-800

Image Part Number Price (excluding tax)
Attotive pressure (direct) Attotive pressure liquid powder plasma processing device full-scale research PPU-800-Part Number-PPU-800

PPU-800

Available upon quote

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About Company Handling This Product

SAKIGAKE-Semiconductor

Response Rate

100.0%

Response Time

120.0hrs

Related search keywords

Atmospheric pressure plasma device
Atmospheric pressure plasma device　SAKIGAKE-Semiconductor
SAKIGAKE-Semiconductor

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