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Suitable for finishing polishing before the CMP polishing process. A abrasive that combines durability, conservative, and excellent polishing power. ■ Features ・ Finish polishing can be performed using abrasives of about 1 µm of abrasive grain. ・ It is possible to polish a few µm units efficiently. ・ Prevents edge, and can perform precision polishing with high flat degree.
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HP TX boardHandling Company
Musashino Denshi, INC.Categories
Image | Price (excluding tax) | Abrasive | Granularity | Material | Process |
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Available upon quote | Diamond slurry, diamond solution, WA abrasive, GC abrasive ... etc. | 0.25μm ~ 3μm | Tin Antimon | Finishing polishing |
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Reviews shown here are reviews of companies.