28 Semiconductor Manufacturing Equipment Component & Part Machining Manufacturers in 2024
This section provides an overview for semiconductor manufacturing equipment component & part machining as well as their applications and principles. Also, please take a look at the list of 28 semiconductor manufacturing equipment component & part machining manufacturers and their company rankings. Here are the top-ranked semiconductor manufacturing equipment component & part machining companies as of November, 2024: 1.Upland Fab, 2.Kennebec Technologies, 3.KLA-Tencor Corp..
Table of Contents
- What Is Semiconductor Manufacturing Equipment Component & Part Machining?
- List of 28 Semiconductor Manufacturing Equipment Component & Part Machining Manufacturers
- List of 2 Semiconductor Manufacturing Equipment Component & Part Machining Products
- Global Distribution of Semiconductor Manufacturing Equipment Component & Part Machining Manufacturers by Country
Categories Related to Semiconductor Manufacturing Equipment Component & Part Machining
What Is Semiconductor Manufacturing?
Semiconductor manufacturing is used to manufacture semiconductors used in transistors and integrated circuits.
Semiconductors are used not only in personal computers and smartphones, but also in cloud services, data centers, and many other electronic devices. Technical innovation of semiconductors is progressing while taking into account information storage, numerical calculation, logical value computation, and the fast processing speed of these processes, energy saving, and space saving aspects of semiconductors.
Semiconductor Manufacturing is essential for dramatic progress in line with the higher performance and technological innovation of semiconductors.
Uses of Semiconductor Manufacturing
Semiconductor manufacturing, as the name implies, is used for manufacturing semiconductors. Major semiconductor components include transistors and diodes, which are individual elements used to electrically control the flow and direction of electricity in equipment, CPUs that control the arithmetic processing of programs and other data in equipment, as well as memory that stores programs and other data.
Semiconductor manufacturing is also used for CMOS image sensors used in cameras.
Principle of Semiconductor Manufacturing
The basic operations of Semiconductor manufacturing can be categorized into Circuit Design & Pattern Design, Photomask Making, Front-end Processes, and Back-end Processes.
1. Circuit Design and Pattern Design
Circuit and pattern design involves designing circuits that realize the required functions and studying efficient patterns by running simulations many times. For pattern design of semiconductor devices, dedicated CAD software is used.
2. Photomask Creation
Photomask creation is the process of creating an original plate for transferring a circuit pattern onto a semiconductor wafer. Transistors and wiring on the surface of a semiconductor wafer are extremely detailed, and the circuit pattern is enlarged and drawn on the surface of a transparent glass plate.
3. Front-End Process
The front-end process is up to the creation of chips on silicon wafers. This series of processes includes cleaning, photolithography, etching, film deposition, ion implantation, and planarization, and is repeated many times.
4. Back-End Process
The back-end process is from the semiconductor chip made on a silicon wafer until the chip is completed by subdividing it into smaller pieces. Each process includes dicing, die bonding, wire bonding, molding, and inspection.
Types of Semiconductor Manufacturing
Semiconductor Manufacturing Equipment can be broadly classified into Semiconductor Design Equipment, Photomask Manufacturing Equipment, Wafer Manufacturing Equipment, Wafer Process Processing Equipment, Assembly Equipment, Inspection Equipment, and Related Equipment for Semiconductor Manufacturing Equipment.
1. Semiconductor Design Equipment
Dedicated CAD software has been developed for circuit and pattern design.
2. Photomask Manufacturing Equipment
A photomask, also called a glass dry plate, is a glass or quartz plate on which the original pattern plates used in the manufacturing process of electronic circuit components are formed. Photomask manufacturing equipment deposits a light-shielding curtain such as chrome on a glass substrate and draws a circuit pattern using a laser or electron beam. Developers, dry etching equipment, and inspection equipment are also used.
3. Wafer Fabrication Equipment
First, silicon single-crystal ingots produced to ultra-high purity are cut to a specified thickness by cutting equipment using diamond blades. This is the silicon wafer. Next, the surface of the wafer is polished and placed in a high-temperature oxidation furnace to create an oxide film. A photosensitive agent called photoresist is then applied to the wafer surface using a resist coater/developer.
Circuit patterns are formed by scaling and burning photomask images onto the surface of a wafer. Semiconductor exposure systems are used for this process. In addition, etching and stripping equipment removes unnecessary oxide film and resist.
Ion implantation and annealing equipment is used to implant boron, phosphorus, and other substances into the wafers to make them semiconductors. The wafer is then placed in a plasma system, where inert gas plasma forms an aluminum metal film for electrode wiring on the wafer surface. Finally, wafers are tested chip by chip in the inspection equipment to determine whether they are good or defective, and the previous process is completed.
4. Processing Equipment for Wafer Process
In the back-end process, wafers are first cut and separated into individual chips by dicing saw equipment. The chips are then fixed in place on the lead frames.
5. Assembly Equipment
First, die bonder equipment is used to connect the chips to the lead frame using bonding wire. Next, the chip is packaged with resin using a molding device for protection. Then, individual semiconductor products are cut and separated from the lead frames using a die, and the external leads are formed into a predetermined shape.
6. Inspection Equipment
To exclude initial defects, an accelerated temperature-voltage stress test, called burn-in, is performed while performing function tests. Finally, electrical characteristic tests and visual structural inspections are performed to remove defective products. Reliability tests such as environmental tests and long-term life tests are also required.
List of 28 Semiconductor Manufacturing Equipment Component & Part Machining Manufacturers
*Including some distributors, etc.
Sort by Features
- Default
- Company Size: largest first
- Year Founded: oldest first
- Year Founded: earliest first
Sort by Area
- United States of America
- Japan
- Taiwan
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KLA-Tencor Corp.
Chip Manufacturing
Manufacturer Overview
KLA- Tencor Corporation was established in April 1997. Its main products are reticles, manufacturing chips, surface profilers, packaging, compound semiconductors, nano-chemical testers, and KT pro equipement. The company has 19 global locations with approximately 14000 global employees. It is a semiconductor manufacturing and related to nano-electronics company. They make research on electron, photon optics, data analytics, machine learning, and sensors. Consequently, they have produced precise optical tools, broadband plasma wafer inspectors, and butterfly effect detectors. It enables evolution acroess the automotive, data center and mobile industries.
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PI (Physik Instrumente) L.P.
Semiconductor Manufacturing
Manufacturer Overview
Physik Instrumente aka PI, founded 50 years ago, is a private company that creates and produces automation systems, including hexapods, air bearings, and piezo drives that are used in life-sciences, photonics, and aerospace industries and research institutes. Their products are manufactured in North America, Europe, and Asia. Physik Instrumente is ITAR registered. The company's head office is located in Auburn, America. And its manufacturing and other facilities are located in New England.
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B & Z Manufacturing Co. Inc.
SEMICONDUCTOR MACHINING INDUSTRY
Manufacturer Overview
B&Z Manufacturing, started in 1960 and based in San Jose, California, is an ISO 9001-certified manufacturer of ultra-precision components made using multi-axis milling, turning, and ultra-precision machining. Some of its products include instruments for the dental industry, face bows, and articulators used in facial reconstructions, and it works with several materials, including stainless steel, aluminum, and brass. It’s UL-registered, and its other capabilities include vertical milling, precision sawing, and surface grinding. It also provides supplemental CNC machining services such as fixture building, bead blasting, and CAD engineering.
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Kennebec Technologies
SEMICONDUCTOR MANUFACTURING MACHINE PARTS
Manufacturer Overview
Kennebec Technologies is an Augusta, Maine-based U.S. contract manufacturer specializing in tight-tolerance components that was originally founded in 1972 as Kennebec Tool & Die before rebranding in 2006. The company’s fabrication capabilities include multi-axis CNC milling, drilling, and grinding, as well as exotic alloy machining and precision casting. It also offers design assistance, process optimization, and assembly services for customers requiring additional support. The company chiefly serves the telecommunications, renewable energy, defense, and semiconductor industries.
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Manufacturer Overview
Upland Fab is an American contract manufacturer specializing in complex parts design and fabrication that was established in Upland, California in 1970. The company offers a range of inhouse fabrication capabilities including CNC turning, 5-axis machining, cryogenic deburring, and digital production definition (DPD). It also offers annealing for dimensional stability or stress relief, honeycomb composites machining, and just-in-time JIT delivery services. The company’s capabilities are mainly geared to the production of precision plastic parts and assemblies for its clients in the medical, semiconductor, and defense industries.
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Hitachi High-Tech America, Inc.
Semiconductor Manufacturing Equipment
Company Overview
Hitachi High Tech was established in April 1947 and operates in 26 countries with products and services ranging from semiconductor manufacturing equipment and Medical and Biosystems to Analytical Systems and Manufacturing related equipment and solutions. A unique state-of-the-art technology company with two functions as a manufacturer and a trading company with the motto of "Tackling social issues," the Hitachi High-Tech Group aspires to be a company that pursues not only economic value, such as revenue and profit, but also provides social and environmental value by contributing to resolving social issues through its business activities, including products and services. They also provide one-stop services, such as evaluations and analysis at a global level.
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Vanderveer Industrial Plastics, LLC
SEMICONDUCTOR MACHINING & PARTS FABRICATION
Company Overview
Vanderveer Industrial Plastics, LLC, established in 1951, is a provider of fabrication and machining services such as Multiple-axis machining, material procurement, and processing. The company stocks rods, tubes, and sheets of Teflon, PEEK, polycarbonate, PVC, and polyethylene serving the semiconductor, oil& gas, medical, food distribution, and automotive industries. The company in Placentia, CA, is AS 9100 certified by NSF-ISR and has CNC capabilities such as milling, turning, cutting & sawing, molding, and G10 machining.
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Ohkura Electric Co., Ltd.
Semiconductor Equipment
Manufacturer Overview
Ohkura Electric Co., Ltd. was established in 1933 and is headquartered in Tokyo, Japan. The company is a manufacturer and designer of measuring and flow control products for industries such as power generation, manufacturing, and semiconductors. The company has three product groups: Industrial Instruments Group, Telemetering & Control Group, and Semiconductor Equipment Group. The Industrial Instruments Group’s products include systems equipment, pressure transmitters, electrometers, and gas monitors as individual components and as systems. The Telemetering & Control Group products include transmission systems, modems, and power converters. The Semiconductor Equipment Group products include renewable equipment, furnaces, and precision thermometers.
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Samco Inc
Products
Manufacturer Overview
Samco Inc, founded in 1979 and headquartered in Kyoto, Japan, is a manufacturer and supplier specializing in semiconductor and electronic component manufacturing systems. The company's product portfolio includes low-stress chemical vapor deposition systems, atomic layer deposition systems, reactive ion etching systems, plasma cleaners, and Aqua Plasma Cleaners. These products are applied in various industries, including semiconductor manufacturing, the electronics industry, optoelectronics, photonics, and biotechnology. The company has office locations overseas, including China, the USA, Singapore, Malaysia, and Liechtenstein.
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TOHO KASEI CO.,LTD.
SEMICONDUCTOR / MEMS CLEANING EQUIPMENT
Manufacturer Overview
TOHO KASEI CO., LTD. established in 1956 and based in Yamatokoriyama City, Nara, Japan, is a manufacturer and supplier of fluoropolymer molded products. The company's product range includes fluoropolymer materials, fluoropolymer processed products, fluoropolymer (perfluoroastomer) sealing material (DUPRA), fluoropolymer coating, and fluoropolymer multilayer laminates. These products are used for various applications such as manufacturing and industrial settings, emphasizing materials to process and finalize products using fluoropolymers. Serving industries such as semiconductors, MEMS, LEDs, and solar cell production, it offers a suite of services including machining, bonding, and assembly production.
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NISSIN ION EQUIPMENT CO. LTD.
Equipment Business
Manufacturer Overview
NISSIN ION EQUIPMENT CO. LTD., established in Japan, in 1973 is a manufacturer engaged in ion beam and plasma technology. In 2001 the company established in Taiwan and opened a representative office in Shanghai, China. In 2010 Nissin Ion Equipment USA, Inc. is established as a wholly owned subsidiary in Texas, USA. The company produces cutting-edge silicon devices utilizing 300mm wafers and implantation for Sic and GaN devices and hydrogen ion implantation for VCSELs.
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KAIJO corporation
Bonder
Manufacturer Overview
Kaijo Corporation is a manufacturer of industrial cleaners that originated from Kaijo, Japan. The company started as a maker of fish finders and echo sounders and in 1957, they started manufacturing their first ultrasonic cleaners. They now have two lines of ultrasonic cleaning equipment and systems as well as a range of specialty products and applications. Their main office is located in Tokyo, Japan, with four international offices in China, Taiwan, the United States, and Germany.
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YAMAHA FINE TECHNOLOGIES CO., LTD.
High Frequency Characteristics Measurement
Manufacturer Overview
Yamaha Fine Technologies Co., Ltd. was established in 1987 in Japan as a manufacturer and supplier of factory automation products and car parts. The company produces FA products such as industry-standard testing machines for electronic circuit boards, film punchers, Helium leak testers, Hydrogen leak detectors, Ultrasonic testers, and more. These equipment and machines are applicable in the automation industry for manufacturing mobile devices, home electrical products, and more, and for inspections and testing. The automotive decorative parts are based on the company's skills with wood processing and coating technologies. Precision molding is applied to produce interior parts for luxury cars.
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NuFlare Technology Inc.
Product Information
Manufacturer Overview
NuFlare Technology, Inc., established in 2002 and headquartered in Kanagawa, Japan, is a manufacturer that develops and produces semiconductor production systems. The company's product line includes EB mask writer, mask inspection system, and epitaxial reactors. It also offers services related to the installation, maintenance, and repair of its semiconductor production systems. Its product is used for detecting defects in patterns written on photomasks to be transferred to wafers. The company has achieved ISO 9001 and OHSAS18001 certification. It serves a range of industries, including semiconductor, materials, and device manufacturers.
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TOKYO SEIMITSU CO., LTD.
Semiconductor Manufacturing Equipment
Manufacturer Overview
Tokyo Seimitsu Co. Ltd., established in 1949 and headquartered in Tokyo, Japan, is a manufacturer of semiconductor production equipment and precision measuring instruments. Its product portfolio includes optical measuring instruments, probing machines, polish grinders, X-ray CT systems, and coordinate measuring machines. In 1952, the company developed Japan’s first high-pressure flow-type air micrometer, and in 1958, it created the world’s first germanium pellet automatic thickness sorting machine. It also developed Japan’s first coordinate measuring machine in 1969, followed by Japan’s first wafer-dicing machine in 1970. The company is the industry’s only semiconductor equipment manufacturer with measurement technology.
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SUMITOMO PRECISION PRODUCTS Co., Ltd.
MEMS/Semiconductor Manufacturing Equipment
Manufacturer Overview
Sumitomo Precision Products Co. Ltd., established in 1961 and headquartered in Amagasaki, Japan, is a manufacturer of several products, including hydraulic controls, semiconductor manufacturing equipment, aerospace equipment, and environmental systems. It began manufacturing large heat exchangers in 1963, large propellers in 1967, and LNG vaporizers in 1969. In 1974, it began making ozone generators, and in 1988, it started manufacturing equipment for space applications. The company is ISO 14001 certified, and its product portfolio includes landing gear systems for commercial flights, high-temperature heat exchangers, coolant components for machine tools, LNG vaporizers, and silicon oxide sacrificial layer etching systems.
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ULVAC, Inc
Equipment
Manufacturer Overview
Ulvac Inc., established in 1952 and headquartered in Kanagawa, Japan, is a manufacturer of vacuum equipment, components, peripheral devices, and materials for the solar cell and semiconductor industries, among others. The company operates businesses in six areas, including materials, components, electronic devices, semiconductors, and flat panel display production equipment. Some of its products include roll coaters, semiconductor production equipment, LED production equipment, leak detectors, and vacuum brazing furnaces. It is ISO9001 certified, and its net sales in the 2022 fiscal year were 227.5 billion Japanese Yen, with 34% of this amount coming from semiconductor and electronic device production equipment.
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Nissin Electric Co., Ltd.
Ion Implanter
Manufacturer Overview
Nissin Electric Co., Ltd., established in Kyoto, Japan, in 1917, is a Supplier of electrical energy by substation equipment, and grid connection technology. The company provides factories and office buildings to realize the optimal operation of energy and technical support. They also provide industrial infrastructure, with an emphasis on power system and energy equipment. Their product range includes gas insulated switchgear, storage battery system, vehicle recognition system, high voltage test product and multiple environmental sensors.
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DISCO Corporation
Precision Machines
Manufacturer Overview
Disco Corporation is a producer of precision cutting and grinding machines founded in Japan last 1937. Aside from manufacturing services, they also offer maintenance, training, refurbishment, and lease of precision cutting and grinding materials. This company is entirely based in Japan with Tokyo as the location for its Head Office. Its three branch offices are located in Osaka, Kyushu, and Sendai. They also have three plants, two of which are in Hiroshima namely, Kure and Kuwabata, while their Chino Plant is in Nagano.
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Chain We Machinery Co., LTD.
EFEM Wafer Handling Module
Manufacturer Overview
Chain We Machinery Co., Ltd was established in 1988 and is headquartered in Taichung City, Taiwan. The company is a designer and producer of customized factory automation conveying equipment to customers in Asia, Europe, and the United States. Customers are generally in the semiconductor equipment, electronics, logistics, and food industries. The company’s products include roller and belt conveyors, linear tracks, pallet dispensers, aluminum framework, and other components designed to improve efficiency in Industry 4.0 environments.
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UniTemp GmbH
Rapid Thermal Process Ovens and Vacuum Process Oven
Manufacturer Overview
UniTemp GmbH, founded in 2000, is a manufacturer based in Pfaffenhofen, Germany, specializing in thermal process equipment. UniTemp offers a range of products including reflow solder systems for research and development (R&D) purposes and prototyping in small series manufacturing. They also provide rapid thermal process ovens and vacuum solder systems (VSS) for soldering processes. Additionally, UniTemp manufactures hot plates, hot chunks, wire bonders, and die bonders that cater to various industrial applications. Furthermore, the company develops software utilizing the SIMATIC© controller from Siemens, which enables easy engineering of the thermal process equipment within the Totally Integrated Automation Portal (TIA Portal).
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SpeedFam Co., Ltd.
Single Side Polisher/Lapper
Manufacturer Overview
SpeedFam Company Limited, established in 1971 and headquartered in Kanagawa, Japan, is a grinding, polishing, and finishing machine manufacturer. The company's products include single-sided polishers, fine grinders, and edge profilers. It also offers laser equipment that is typically used for local welding of various metals, dry chemical planarization (DCP), and advanced flattening systems. These products are primarily used in processing bare silicon wafers, and the company's single-sided systems offer abrasive processes for a broad range of production requirements and are often used for semiconductor production.
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UltrasonicEngineering Co.,Ltd.
Ultrasonic Wire Bonder
Manufacturer Overview
Ultrasonic Engineering Co.,Ltd., founded in 1956 and based in Tokyo, Japan, is a manufacturer of electrical equipment, machinery, and supplies among others. The company has 186 patents and offers a wide range of products including cltrasonic wire bonders, ultrasonic cleaners, ultrasonic plastic welders, ultrasonic metal bonders, and ultrasonic measuring instruments among others. The company serves various industries including chemicals & pharmaceuticals, paper & printing, transport & logistics, textiles, and many more.
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Lasertec Corporation
Semiconductor-related
Manufacturer Overview
Lasertec Corporation, founded in 1960 and headquartered in Yokohama, Japan, is a manufacturer and supplier of semiconductor-related systems, FPD-related systems, and laser microscopes. The company's product portfolio includes mask inspection systems, mask edge inspection systems, FPD photomask inspection systems, laser microscopes, and lithium-ion batteries. These products find applications in various sectors, including materials science, the flat panel display industry, semiconductor manufacturing, biomedical and life sciences, as well as research and development. The company is ISO 45001 and ISO 9001 certified, with offices in the USA, China, Singapore, Taiwan, and South Korea for global outreach.
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Super Radiator Coils
Semiconductor Production Products
Manufacturer Overview
Super Radiator Coils was established in 1928 in Chaska, Minnesota, US, and is the manufacturer of fluid coils. The company's product portfolio comprises coils, selection software, industrial heat exchange, and nuclear products. The heat exchange is corrosive resistance, ensuring efficient heat transfer and improving efficiency. Its products are essential for power generation, pollution control, heat recovery, fluidized bed dryers, and natural gas cooling. The products are necessary for computer and electronics cooling for computing, room conditioning and rack cooling, and HVAC applications.
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OHMIYA IND.CO.,LTD
Semiconductor and Electronic component production equipment
Company Overview
OHMIYA IND.CO.LTD, established in 1975 and headquartered in Hiroshima, Japan, is a manufacturer and distributor of precision measuring equipment, Semiconductor & Liquid crystal equipment, and offers Maintenance service of rotating devices. The company offers a wide range of products such as spin dryers that dry water droplets and moisture on semiconductor wafers, tape removers that remove protection films from wafers, and UV Curing Systems that emit UV radiation to cure tapes/films in electronic components.
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Hitachi Power Solutions Co.,Ltd.
Semiconductor Device Manufacturing Machine
Company Overview
Hitachi Power Solutions Co. Ltd., founded in 1960, is a Japanese manufacturer and supplier headquartered in Hitachi City, Ibaraki, providing energy solutions. The company supports the effective use of renewable energy by installing solar and wind power generation and storage battery systems. It also offers energy management services that facilitate power purchasing agreements (PPAs), connecting power generation operations with end-users. It further provides equipment and related management services as solutions to replace aging industrial equipment. Equipment for secondary battery assemblies is also offered to meet the increasing demand for eco-friendly semiconductors and support the adoption of electric vehicles.
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LAM RESEARCH CORPORATION
semiconductor manufacturers
Distributor Overview
Lam Research Corporation, founded in 1980 and based in Fremont, California, is a global supplier of semiconductor fabrication equipment. Specializing in thin film deposition, plasma etch, and photoresist strip processes, the company utilizes a line of high-precision mass metrology systems, enabling an Å-level quantification to process changes, and accommodating parts up to 8 meters in size. Its products and services enable its customers to build smaller, faster, and power-efficient electronic devices.
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Semiconductor Manufacturing Equipment Component & Part Machining Manufacturer Ranking
*Including some distributors, etc.Ranking as of November 2024
Derivation Method| Rank | Company | Click Share |
|---|---|---|
| 1 | Upland Fab |
13.6%
|
| 2 | Hitachi High-Tech America, Inc. |
10.7%
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| 3 | Kennebec Technologies |
9.9%
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| 4 | KLA-Tencor Corp. |
8.4%
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| 5 | PI (Physik Instrumente) L.P. |
7.3%
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| 6 | B & Z Manufacturing Co. Inc. |
6.6%
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| 7 | Vanderveer Industrial Plastics, LLC |
4.4%
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| 8 | Ohkura Electric Co., Ltd. |
3.6%
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| 9 | TOHO KASEI CO.,LTD. |
3.5%
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| 10 | Samco Inc |
3.2%
|
Derivation Method
The ranking is calculated based on the click share within the semiconductor manufacturing equipment component & part machining page as of November 2024. Click share is defined as the total number of clicks for all companies during the period divided by the number of clicks for each company.Number of Employees
- Hitachi High-Tech America, Inc.: 13,397
- ULVAC, Inc: 6,235
- Nissin Electric Co., Ltd.: 5,382
Newly Established Company
- Hitachi High-Tech America, Inc.: 2002 (22 years ago)
- UniTemp GmbH: 2000 (24 years ago)
- NISSIN ION EQUIPMENT CO. LTD.: 1999 (25 years ago)
Company with a History
- Super Radiator Coils: 1928 (96 years ago)
- Ohkura Electric Co., Ltd.: 1933 (91 years ago)
- KAIJO corporation: 1948 (76 years ago)
Semiconductor Manufacturing Equipment Component & Part Machining Manufacturers in United States
*Including some distributors, etc.
- KLA-Tencor Corp.
- PI (Physik Instrumente) L.P.
- B & Z Manufacturing Co. Inc.
- Kennebec Technologies
- Upland Fab
- Hitachi High-Tech America, Inc.
- Vanderveer Industrial Plastics, LLC
Global Distribution of Semiconductor Manufacturing Equipment Component & Part Machining Manufacturers by Country
*Including some distributors, etc.
| Country | Number of Companies | Share (%) |
|---|---|---|
Japan
|
13 | 61.9% |
United States of America
|
7 | 33.3% |
Taiwan
|
1 | 4.8% |
List of Semiconductor Manufacturing Equipment Component & Part Machining Products
2 products are listed.
Adwells Co., Ltd.
Ultrasonic high accuracy flip chip bonder (US Precision Flip Chip Bonder)
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Adwells Co., Ltd.
Ultrasonic metal joining device for power devices (Ultrasonic Metal Bonder)
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Ultrasonic joiner ideal for power devices ・ High rigidity horn clamp mechanism ・ High -precision position control ・ Enriched process monitoring...
