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This section provides an overview for dicings as well as their applications and principles. Also, please take a look at the list of 5 dicing companies and their company rankings. Here are the top-ranked dicing companies as of January, 2025: 1.Silicon Valley Microelectronics, Inc., 2.American Precision Dicing, Inc, 3.Sales and Service Inc..
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Dicing is a precision process used in semiconductor manufacturing, typically following the photolithography stage. It involves cutting individual chips from a wafer, each containing its own set of operations and processes. This method is characterized by high precision cutting techniques and is crucial in the production of semiconductor devices.
A wafer can contain tens of thousands of chips, each separated by scribe lines. Dicing is performed along these lines using specialized equipment, such as a dicer or a laser dicer. The process requires high precision, typically along scribe lines of about 100μm or less. Common dicing methods include mechanical dicing with a thin circular blade (dicing saw) and laser dicing using thermal stress.
While primarily used for semiconductor wafers, dicing is also applicable to other electronic components like MEMS, ceramics, and glass, often provided as a contracted service due to the precision required.
Dicing is essential in semiconductor manufacturing to separate individual chips from wafers. It is applicable to various wafer materials with different mechanical characteristics, including silicon, silicon carbide, and gallium nitride.
The process is also used in precision electronic components like MEMS, LEDs, and sensors. In broader applications, dicing is employed in industries such as packaging, automotive components manufacturing, and textiles for cutting materials into specific shapes and sizes.
Dicing semiconductor wafers requires high processing precision, focusing on cut line accuracy and chipping width. Dicing devices include dicers and laser dicers, each offering distinct advantages in precision and process.
Dicers use an ultra-thin circular blade to cut through the wafer, often employing diamond-tipped blades for precision. They are known for their high-speed cutting capability and may use pure water during the process.
Laser dicers utilize laser technology for cutting, including ablation processing and the Stealth Dicing™ process. This method is advantageous for its dry process and reduced environmental impact.
Companies may either conduct dicing in-house or outsource it. In-house dicing requires selecting suitable equipment based on processing precision, quality, speed, and cost. For outsourcing, considerations include compatibility with the material, processing method, quality control, delivery time, and pricing.
*Including some distributors, etc.
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Silicon Valley Microelectronics, Inc., established in 1990 and headquartered in Santa Clara, USA, is a supplier and distributor of silicon wafers and wafer services. The company offers silicon wafers in 50mm to 450mm diameters and non-silicon wafers, including float-zone, silicon carbide, and gallium nitride wafers. It supplies 100mm and 150mm SiC wafers that have hardness and stability under heat and high voltage. Its silicon on insulator wafers are used in microelectromechanical systems, and CMOS integrated circuit fabrications. The company also provides processing services such as thermal Oxide, silicon epitaxy, and photolithography.
Ranking as of January 2025
Derivation Method| Rank | Company | Click Share |
|---|---|---|
| 1 | Silicon Valley Microelectronics, Inc. |
36.2%
|
| 2 | American Precision Dicing, Inc |
27.7%
|
| 3 | Sales and Service Inc. |
12.8%
|
| 4 | MPE, Inc. |
12.8%
|
| 5 | Syagrus Systems, LLC |
10.6%
|
Derivation Method
The ranking is calculated based on the click share within the dicing page as of January 2025. Click share is defined as the total number of clicks for all companies during the period divided by the number of clicks for each company.Number of Employees
Newly Established Company
Company with a History
*Including some distributors, etc.
*Including some distributors, etc.
| Country | Number of Companies | Share (%) |
|---|---|---|
|
United States of America
|
1 | 100.0% |
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