This section provides an overview for bonding wire as well as their applications and principles. Also, please take a look at the list of 7 bonding wire manufacturers and their company rankings. Here are the top-ranked bonding wire companies as of November, 2024: 1.California Fine Wire Co., 2.Berkenhoff GmbH, 3.ELMAG ENTWICKLUNGS UND HANDELS GMBH.
Table of Contents
The bonding wire is a thin metal wire used in the "wire bonding" process, one of the manufacturing processes for semiconductor devices such as ICs and LSIs. It is a connection material used to exchange power and electrical signals between semiconductor devices and the outside of the package.
IC chips made in the front-end process of semiconductor manufacturing are separated from wafers in the back-end process and fixed one by one to a metal plate called a lead frame inside the package. A bonding wire is then used to connect the electrodes of the chip to the lead frame.
The bonding wire is used as a material to connect the electrode pads of semiconductor devices to the lead frames in the back-end process of semiconductor device manufacturing.
In the wire bonding process, the wire is connected to the electrode; the wire is deformed to form a loop; the wire is connected to the external terminal, and then the wire is cut, a process repeated at high speed. This process is the same for semiconductor devices with a small number of pins, such as discrete semiconductors and general-purpose ICs, as well as for semiconductors with more than 100 pins, such as LSIs.
Bonding wire materials include gold, silver, copper, and aluminum.
Gold bonding wire is the most commonly used high performance wire. It has excellent electrical conductivity, corrosion resistance, processability, and chemical stability. It is effective for bonding long spans, where the distance between the chip electrode and the lead frame is long. It is also effective for fine pitch bonding, where the distance between the leads is very narrow. There is a disadvantage that it is expensive because it is made of gold with a purity of 99% or higher.
Silver and copper bonding wires have been developed to replace expensive gold bonding wires to significantly reduce costs.
Aluminum bonding wire is used in power devices that require high current flow in harsh environments. They have excellent bondability and moisture resistance and are used as thicker diameter wires or ribbon-shaped wires.
There are two bonding wire connection methods: ball bonding and wedge bonding.
Ball bonding is the most common wire bonding method. The bonding wire passes through a tube called a capillary in the bonding device, and an electrical discharge melts the wire at the bottom of the capillary to form a metal ball at the tip. The capillary descends from just above the connection point to below, and when the ball hits the metal pad, ultrasonic waves, heat, and load are applied to deform the wire and bond it to the pad.
Gold, silver, and copper wires are used for ball bonding, but aluminum wire is not suitable for ball bonding because its surface is oxidized by electrical discharge.
In wedge bonding, a tool called a wedge is passed through the wire and ultrasonic waves and loads are applied to the wire to bond it to the pad. Since it does not melt the wire by causing an electrical discharge as in ball bonding, it is often used for bonding aluminum wire, but gold, silver, and copper wire can also be used.
*Including some distributors, etc.
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California Fine Wire Co. was founded in 1961 and is headquartered in Grover Beach, California, US, as a manufacturer of metal and alloy wire products. The product portfolio includes various wires like drawn, insulated, electroplated, stranded, and flat ribbon wires, along with services such as wire straightening, packaging, and research. These products are applied in aerospace for navigation, communication systems, and deep-space probes; in electronics for consumer electronics, semiconductors, and sensors; and in the medical sector for devices like pacemakers and catheters. They cater to industries like aerospace, electronics, and medical, supporting a wide range of applications.
Through its subsidiaries, Heraeus Group serves many industries around the world including green power generation, telecommunications, agriculture, aerospace, medical, jewelry, and environmental protection. Heraeus Group companies create products including fiber optics, ceramics, custom metals, surgical equipment, special purpose lamps, and photovoltaics.
Tatsuta Electric Wire and Cable Co. Ltd., established in 1945 and headquartered in Higashiosaka, Japan, is a manufacturer of electric wires, electronic materials, medical products, and sensors. The company began manufacturing and selling telecommunication wires and cables in 1955. In 1981, it started manufacturing water leakage detection systems, and in 1984, it began selling bonding wire. Its telecommunications division received ISO 9001 certification in 1996, and the electric wire and cable division in 1998. The company began the production of EMI shielding film in 2003, and its product portfolio includes broadcasting cables, bonding wires, liquid leakage sensors, and functional paste.
Schtec Makine San. ve Tic. AS, established in 2013 and headquartered in Basaksehir, Istanbul, is a developer, manufacturer, and supplier of PVC machining centers and other PVC and aluminum machinery. The company's products include servo-controlled automatic double-head aluminum cutting machines, automatic mullion connector screwing machines, and profile machining and cutting centers. These products are used to create customized shapes and structures on a large scale for manufacturing across market sectors that include construction, water management, and outdoor signage.
TANAKA Precious Metals, a subsidiary of TANAKA Holdings Co., Ltd., established in 1885, is a Japanese manufacturer headquartered in Chiyoda-ku, Tokyo, specializing in precious metals. The company's product offerings include bonding wires and ribbons, ranging from ultra-fine wires for metal bonding to thick wires for power devices. It also provides metal honeycomb and pellet catalysts used for exhaust gas oxidation and decomposition. Precious metal pastes and powders, commonly used in circuitry and sensors, are also available. These products cater to electronic mechanical and functional material, medical, and sensor industries. Furthermore, the company provides plating services, including precious metal plating for semiconductor components.
ELMAG Entwicklungs und Handels GmbH, founded in 1984 and located in Tumeltsham, Austria is a wholesaler and supplier of industrial machinery and equipment. The company’s product category includes compressed air technology, welding technology, stone cutting, workshop equipment, and power generators. It also offers welding equipment, plasma cutters, extraction systems, Metal cleaning equipment, and induction heaters. It is ISO 9001 certified, indicating that its production processes and products are of standard quality. It has service points in Austria, Germany, Switzerland, Slovenia, and Hungary, serving customers worldwide.
Ranking as of November 2024
Derivation MethodRank | Company | Click Share |
---|---|---|
1 | California Fine Wire Co. |
30.9%
|
2 | Berkenhoff GmbH |
15.1%
|
3 | ELMAG ENTWICKLUNGS UND HANDELS GMBH |
12.2%
|
4 | Tanaka Kikinzoku International America Inc. |
11.5%
|
5 | Heraeus Holding GmbH |
10.1%
|
6 | TATSUTA Electric Wire and Cable Co.,Ltd. |
8.6%
|
7 | Schtec Makine San. ve Tic. A.S. |
6.5%
|
8 | DENIOS, Inc. |
5.0%
|
Derivation Method
The ranking is calculated based on the click share within the bonding wire page as of November 2024. Click share is defined as the total number of clicks for all companies during the period divided by the number of clicks for each company.Number of Employees
Newly Established Company
Company with a History
*Including some distributors, etc.
*Including some distributors, etc.
Country | Number of Companies | Share (%) |
---|---|---|
United States of America | 1 | 25.0% |
Germany | 1 | 25.0% |
Japan | 1 | 25.0% |
Austria | 1 | 25.0% |