10 products found
Relatec Co., Ltd.
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Capillaries are components used to connect IC chip electrodes and lead terminals with wires during the wire bonding process in semiconductor manufa...
Relatec Co., Ltd.
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A die collet is a consumable part used in the die bonding process of semiconductor manufacturing to pick up chips with push-up pins, transport them...
Relatec Co., Ltd.
30+ people viewing
Last viewed: 2 hours ago
The correction claw is a part used to correct tilted chips during the die bonding process during semiconductor manufacturing.
Relatec Co., Ltd.
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Last viewed: 4 hours ago
A heat top is a jig that suctions and fixes a lead frame from the bottom during the wire bonding process of semiconductor manufacturing.
Relatec Co., Ltd.
20+ people viewing
Last viewed: 4 hours ago
An intermediate pocket is a part used as a relay when transporting an object from one process to another when sucking and discharging the object wi...
Relatec Co., Ltd.
30+ people viewing
Last viewed: 1 hour ago
The resin collet is a collet with different characteristics from other metal collets, which was developed to suppress the impact for picking up chi...
Relatec Co., Ltd.
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A stage is a component (table) used to hold a wafer during the process of making chips from a wafer in the semiconductor manufacturing process.
Relatec Co., Ltd.
30+ people viewing
Last viewed: 1 hour ago
A suction nozzle is a component used to suction and pick up IC chips, etc., and transport and bond them onto a lead frame, or in the case of electr...
Relatec Co., Ltd.
20+ people viewing
Last viewed: 1 hour ago
Transfer pins are parts used in semiconductor manufacturing to spread solder uniformly on the stage and transfer the solder to the target object.
Relatec Co., Ltd.
20+ people viewing
Last viewed: 13 hours ago
The window clamper is a fixture that secures the fingers of the lead frame to the heat block to enable wire bonding between the lead frame and the ...