This product is registered by OKI Circuit Technology Co.,Ltd..
About This Product
We provide the best VIA structure to the GHz compatible print wiring board.
Action
･ The difference between the characteristic impedance value of the signal wire and the characteristic impedance value of the VIA part is reduced.
effect
･ Uniform of signal propagation speed
･ Reduce reflex and attenuation of transmission tracks
Establishment of back drill method
･ Used in high -speed transmission compatible back planes and other high -plate thick printing boards.
The effect of VIA stap removal method (back drill)
･ Eliminate the drawbacks of the TH implementation connector.
Impact on the electrical characteristics of VIA staps
･ The higher the difference between the characteristics impedance value between the VIA portion and the wiring, the increase in reflection and attenuation.
<Wiring condition> Wiring length = 100mm, via number = 2 pieces
This is the version of our website addressed to speakers of English in
the United States.
If you are a resident of another country, please select the appropriate version of Metoree for your country in the drop-down menu.
