Ultra-high multilayer <100-layered> Rigid printing wiring board (Over100layer Advance SUPER MULTI-LAYER RIGID PCB)-Ultra -high multilayer <100 layers> Rigid printing wiring board

Ultra-high multilayer <100-layered> Rigid printing wiring board (Over100layer Advance SUPER MULTI-LAYER RIGID PCB)
OKI Circuit Technology Co.,Ltd.

About This Product

Realizes 100 layers on a rigid substrate using high TGFR-4
Compatible with high -density wiring accommodation while ensuring electrical characteristics

Feature
･ Compatible with high multi-layer boards that exceed 100 layers in the normal manufacturing process using high TGFR-4
･ It is possible to combine various VIA structures such as IVH, build -up, penetrating hole, etc.
･ Characteristic impedance control and conductor resistance reduction by proprietary structure

Main adaptation examples
･ Semiconductor test device, probe card

Model
There are 1 models for this product.

Product
Ultra-high multilayer <100-layered> Rigid printing wiring board (Over100layer Advance SUPER MULTI-LAYER RIGID PCB)

Handling Company
OKI Circuit Technology Co.,Ltd.

*Please note that we may not be able to accommodate sample requests.

1 Models of Ultra-high multilayer <100-layered> Rigid printing wiring board (Over100layer Advance SUPER MULTI-LAYER RIGID PCB)

Product Image	Part Number	Price (excluding tax)	Board size	Board structure	Number of layers	Thickness
	Ultra -high multilayer <100 layers> Rigid printing wiring board	Available upon quote	φ480mm	52+50IVH structure	102 layers	6.8mm