Semiconductor test print wiring board burn in board-Burn -in board
Semiconductor test print wiring board burn in board-OKI Circuit Technology Co.,Ltd.

Semiconductor test print wiring board burn in board
OKI Circuit Technology Co.,Ltd.


About This Product

・ We provide a high -integrated large multi -layered substrate that supports multi -pin (1,000 pin class). ・ We provide high -precision and large substrates corresponding to narrow pitch (0.4mm pitch).

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    Semiconductor test print wiring board burn in board




*Please note that we may not be able to accommodate sample requests.

1 Models of Semiconductor test print wiring board burn in board

Product Image Part Number Price (excluding tax) Maximum shape Number of layers Socket pitch Thickness composition material surface treatment
Semiconductor test print wiring board burn in board-Part Number-Burn -in board

Burn -in board

Available upon quote 482 x 623mm 2 -layer to 16 layers 0.40mm ~ 1.6mm ~ SVH, compatible with holes FR-4, HighTGFR-4 Covered money plating, soulder coat, bronze through

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