Large current / heat dissipation thick copper multilayer print wiring plate
OKI Circuit Technology Co.,Ltd.
About This Product
Hyaku copper etching technology, thick copper piled technology
Feature
･ Conventional products have a copper thickness of about 70 μm, whereas this product has a copper thick of 175 to 215 μm, improving heat dissipation.
･ Realize a blind hole structure with copper by the company's high -layer manufacturing technology / IVH manufacturing technology.
Product Specifications
5 -layer IVH structure
Corresponding examples
･ Compact power supply
･ Large current board (10A or higher)
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Product
Large current / heat dissipation thick copper multilayer print wiring plate
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Handling Company
OKI Circuit Technology Co.,Ltd.
1 Models of Large current / heat dissipation thick copper multilayer print wiring plate
| Product Image | Part Number | Price (excluding tax) |
|---|---|---|
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Hypercopper multilayer print wiring plate |
Available upon quote |
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About Company Handling This Product
OKI Circuit Technology Co.,Ltd.
- Japan
- 754 employees