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  4. Semiconductor test print wiring board burn in board (OKI Circuit Technology Co.,Ltd.)
Semiconductor test print wiring board burn in board-Burn -in board
Semiconductor test print wiring board burn in board-OKI Circuit Technology Co.,Ltd.

Semiconductor test print wiring board burn in board
OKI Circuit Technology Co.,Ltd.

OKI Circuit Technology Co.,Ltd.'s Response Status

Response Rate

100.0%

Response Time

40.8hours

About This Product

･ We provide a high -integrated large multi -layered substrate that supports multi -pin (1,000 pin class). ･ We provide high -precision and large substrates corresponding to narrow pitch (0.4mm pitch).

  • Product

    Semiconductor test print wiring board burn in board

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1 Models of Semiconductor test print wiring board burn in board

Image Part Number Price (excluding tax) Number of layers Maximum shape Thickness material composition Socket pitch surface treatment
Semiconductor test print wiring board burn in board-Part Number-Burn -in board

Burn -in board

Available upon quote

2 -layer to 16 layers

482 x 623mm

1.6mm ~

FR-4, HighTGFR-4

SVH, compatible with holes

0.40mm ~

Covered money plating, soulder coat, bronze through

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About Company Handling This Product

OKI Circuit Technology Co.,Ltd.

Response Rate

100.0%

Response Time

40.8hrs

Company Overview

OKI Circuit Technology Co., Ltd. is a Japanese manufacturer of printed circuit boards (PCBs) and electronic co...

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  • Japan

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