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  2. Large current / heat dissipation thick copper multilayer print wiring plate (OKI Circuit Technology Co.,Ltd.)
Large current / heat dissipation thick copper multilayer print wiring plate-Hypercopper multilayer print wiring plate
Large current / heat dissipation thick copper multilayer print wiring plate-OKI Circuit Technology Co.,Ltd.

Large current / heat dissipation thick copper multilayer print wiring plate
OKI Circuit Technology Co.,Ltd.

OKI Circuit Technology Co.,Ltd.'s Response Status

Response Rate

100.0%

Response Time

40.8hours

About This Product

Hyaku copper etching technology, thick copper piled technology Feature ･ Conventional products have a copper thickness of about 70 μm, whereas this product has a copper thick of 175 to 215 μm, improving heat dissipation. ･ Realize a blind hole structure with copper by the company's high -layer manufacturing technology / IVH manufacturing technology. Product Specifications 5 -layer IVH structure Corresponding examples ･ Compact power supply ･ Large current board (10A or higher)

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    Large current / heat dissipation thick copper multilayer print wiring plate

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1 Models of Large current / heat dissipation thick copper multilayer print wiring plate

Image Part Number Price (excluding tax)
Large current / heat dissipation thick copper multilayer print wiring plate-Part Number-Hypercopper multilayer print wiring plate

Hypercopper multilayer print wiring plate

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About Company Handling This Product

OKI Circuit Technology Co.,Ltd.

Response Rate

100.0%

Response Time

40.8hrs

Company Overview

OKI Circuit Technology Co., Ltd. is a Japanese manufacturer of printed circuit boards (PCBs) and electronic co...

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