Chip component visual inspection equipment OVS-6410 6610
Okano Electric Co., Ltd.


About This Product

The surface of the chip component (4th/6th side) is determined by image processing using Okano's proprietary software. Equipment design takes into consideration stability of inspection accuracy and no damage to workpieces. While electronic components are becoming smaller and more value-added, cost competition is also becoming more intense, and conventional visual inspection has reached its limits in terms of speed and stability of inspection quality. Therefore, it has become essential to introduce visual inspection equipment that can detect product defects accurately and at high speed. Our OVS series is capable of high-speed and stable inspection of 4 and 6 sides of chips (up to 5,000 chips/min), and has been developed as a device that is extremely gentle on products due to its simple mechanism. In addition, by adopting a newly developed high-speed 2-light switching mechanism, we have achieved higher inspection performance than before. We also have wafer chip visual inspection equipment.

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    Chip component visual inspection equipment OVS-6410 6610

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