LTCC board Serafeille® (multilayer board) NL-Ag3
NIKKO COMPANY
This product is registered by NIKKO COMPANY.
About This Product
■Summary
Serafille® is a low-loss LTCC board using Ag-based conductors.
Recommended for the following uses.
■Ceramic package
Serafille® can store semiconductors in the cavity. With organic packages, gases (outgass) generated from the base material can cause performance deterioration, but Serafille® is fired at a high temperature of approximately 850°C, so there is no need to worry about outgasses. The base material of Serafille® is made of glass ceramics and is suitable for airtight sealing as it does not allow moisture to pass through. Since conductor loss is lower than that of HTCC, there is a high degree of design freedom and contributes to the miniaturization of components.
■High frequency module board
It has lower dielectric loss than a general resin substrate (FR-4) and lower conductor loss than HTCC, making it suitable for high frequency applications. It is possible to incorporate passive elements such as coils, capacitors, and resistors in the inner layer, contributing to the miniaturization and high functionality of components.
■Interposer substrate with silicon substrate
An interposer board is a relay board that electrically connects a semiconductor chip and a board. Serafeille®, which allows three-dimensional wiring with a high degree of design freedom, is suitable for interposer boards.
Features
■High-density wiring
Since the coil, capacitor, and resistor can be built into the board, the board size can be reduced. Excellent dimensional accuracy of ±0.3% improves mounting performance.
■Electrical conductivity due to low temperature sintering
Since an Ag-based conductor is used, conductor loss can be kept low. As surface treatment, Ni/Au plating treatment and Ni/Pd/Au plating treatment can be selected.
■Products used
・High frequency application board (front end module/sensor board)
・Small package component board
・Interposer substrate with silicon substrate
design guidelines
■Standard specifications
・External dimensions: ~120 x 120mm
・Dimension tolerance: ±0.3~%
・Substrate thickness: 0.25~mm
・Plate thickness tolerance: ±10%
・Layer thickness: 0.05~0.2mm
・Number of layers: 20 layers wiring possible
・Cavity: Possible
・Via diameter: 0.05~0.2mm
・Via pitch: 0.25mm~
*The item values are representative values and are not guaranteed values.
This is the version of our website addressed to speakers of English in
the United States.
If you are a resident of another country, please select the appropriate version of Metoree for your country in the drop-down menu.
