This section provides overview, applications, and principles of ceramic substrates. Also, please take a look at the list of 21 ceramic substrate manufacturers and their company rankings.
Ceramics are hard, electrically insulating, heat and corrosion-resistant, and widely used in glass, concrete, cement, and fine.
Ceramic substrates include alumina substrates, alumina-zirconia substrates, aluminum nitride (AlN), and silicon nitride (Si3N4). These substrates have excellent mechanical strength, electrical insulation corrosion resistance, heat resistance, and thermal conductivity. Ceramic substrates are becoming necessary due to improved reliability and demand for miniaturization.
Ceramic substrates are used in various applications, including communication, high-power lighting, thin-film circuit boards, heat-dissipating substrates, evaluation substrates in high-temperature regions, and glazing substrates, taking advantage of their characteristics.
High-power LED lighting equipment, laser processing equipment, deep ultraviolet light, and irradiation equipment
Base station antennas, ETC, RF modules, various radars
Automotive LED lamps, automotive control components
Peltier elements, piezoelectric sensors, LEDs, laser diodes, GAN modules, high temperature, accelerated cycle, SiC power semiconductors
IoT communication equipment, antennas, and filters, voltage-controlled oscillators (VCOs), temperature-compensated crystal oscillators (TCXOs)
Features of ceramic substrates are described below.
Heat generation accompanying high integration of semiconductor devices is an important issue, and although thermal VIA and other measures have been taken for printed circuit boards, there are limits to high-density mounting and packaging for high-power semiconductors. Although alumina ceramic has been a driving force in this field, it has become problematic in some cases of the highly demanded characteristics of recent years. In recent years, aluminum nitride and silicon carbide have attracted attention as new ceramic materials for semiconductor packaging, replacing alumina ceramic.
Aluminum nitride is not a natural ceramic material and has excellent thermal conductivity with a theoretical value of 320 W/m K. In practice, it is difficult to improve the raw materials, burnout, and heat resistance. With improvements in raw materials, selection of sintering aids, and sintering conditions, it is now being put to practical use at around 180 W/m K.
Silicon carbide ceramics have become a focus of attention as a substrate material since it was found that they can be made into insulators with high thermal conductivity when beryllium oxide is used as a sintering aid. Unlike aluminum nitride, silicon carbide ceramics cannot be multilayered, so they are mainly used in packaging applications.
Among ceramic substrates, LTCC substrates are particularly advantageous in that they enable the high-density mounting of wiring patterns and have excellent high-frequency characteristics.
In particular, LTCC substrates have a thermal expansion coefficient close to that of semiconductor chips such as Si and GaAs chips and can be mounted as bare chips, facilitating modularization by integrating IC chips and chip components such as LCs. Cavity formation and multilayering are also easy, and its superior resistance to moisture and heat is an advantage that should not be overlooked.
*Including some distributors, etc.
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