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  4. LTCC board Serafeille® (multilayer board) NL-Ag3 (NIKKO COMPANY)
LTCC board Serafeille® (multilayer board) NL-Ag3-NL-Ag3
LTCC board Serafeille® (multilayer board) NL-Ag3-NIKKO COMPANY

LTCC board Serafeille® (multilayer board) NL-Ag3
NIKKO COMPANY

About This Product

■Summary

Serafille® is a low-loss LTCC board using Ag-based conductors. Recommended for the following uses.

■Ceramic package

Serafille® can store semiconductors in the cavity. With organic packages, gases (outgass) generated from the base material can cause performance deterioration, but Serafille® is fired at a high temperature of approximately 850°C, so there is no need to worry about outgasses. The base material of Serafille® is made of glass ceramics and is suitable for airtight sealing as it does not allow moisture to pass through. Since conductor loss is lower than that of HTCC, there is a high degree of design freedom and contributes to the miniaturization of components.

■High frequency module board

It has lower dielectric loss than a general resin substrate (FR-4) and lower conductor loss than HTCC, making it suitable for high frequency applications. It is possible to incorporate passive elements such as coils, capacitors, and resistors in the inner layer, contributing to the miniaturization and high functionality of components.

■Interposer substrate with silicon substrate

An interposer board is a relay board that electrically connects a semiconductor chip and a board. Serafeille®, which allows three-dimensional wiring with a high degree of design freedom, is suitable for interposer boards. Features

■High-density wiring

Since the coil, capacitor, and resistor can be built into the board, the board size can be reduced. Excellent dimensional accuracy of ±0.3% improves mounting performance.

■Electrical conductivity due to low temperature sintering

Since an Ag-based conductor is used, conductor loss can be kept low. As surface treatment, Ni/Au plating treatment and Ni/Pd/Au plating treatment can be selected.

■Products used

・High frequency application board (front end module/sensor board) ・Small package component board ・Interposer substrate with silicon substrate design guidelines

■Standard specifications

・External dimensions: ~120 x 120mm ・Dimension tolerance: ±0.3~% ・Substrate thickness: 0.25~mm ・Plate thickness tolerance: ±10% ・Layer thickness: 0.05~0.2mm ・Number of layers: 20 layers wiring possible ・Cavity: Possible ・Via diameter: 0.05~0.2mm ・Via pitch: 0.25mm~ *The item values ​​are representative values ​​and are not guaranteed values.

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    LTCC board Serafeille® (multilayer board) NL-Ag3

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1 Models of LTCC board Serafeille® (multilayer board) NL-Ag3

Image Part Number Price (excluding tax) Dielectric constant 2.3GHz Dissipation factor (%) 2.3GHz Color Thermal expansion coefficient (10^-6/℃) RT~350℃ Thermal conductivity (W/ (m・K) ) Transverse bending strength (MPa) Density (g/c㎥)
LTCC board Serafeille® (multilayer board) NL-Ag3-Part Number-NL-Ag3

NL-Ag3

Available upon quote

7.1

0.3

White

5.5

3.5

250

2.85

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About Company Handling This Product

NIKKO COMPANY

Company Overview

Nikko Company, founded in 1908 and headquartered in Hakusan, Japan, is an ISO 14001-certified manufacturer of ...

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