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100.0%
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79.8hours
Product
Equel SMFEN Bond magnet Nitroquench-PHandling Company
Daido ElectronicsCategories
Click on the part number for more information about each product
Image | Part Number | Price (excluding tax) | Remaining magnetic flux density, BR (MT) | Residual magnetic flux density, br (kg) | Magnetic force, HCB (KA/M) | Magnetic force, HCB (KOE) | Magnetic force, HCJ (KA/M) | Magnetic force, HCJ (KOE) | Maximum energy (BH) MAX (kj/m³) | Maximum energy (BH) MAX (MGOE) | Density (g/cm³) | Molding method molding method | Heat expansion coefficient (JISK7179) (30-100 ° C) 10⁻⁶/℃ | Bending strength (JISK7171) MPA | Bending strength (JISK7171) (kgf/mm²) | Bending elasticity (JISK7171) MPA | Bending elasticity (JISK7171) (KGF/mm²) | Pressure ring intensity (JISZ2507) MPA | Pressure ring intensity (jisz2507) (kgf/mm²) | BR temperature coefficient α%/℃ |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
SP-14 |
Available upon quote |
750-820 |
7.5-8.2 |
450-520 |
5.7-6.5 |
670-800 |
8.5-10.0 |
98-112 |
12.4-14.0 |
5.8-6.4 |
Compressed molding |
12.6 |
52 |
5.3 |
10,800 |
1,100 |
54 |
5.5 |
-0.05--0.07 |
|
SP-14L |
Available upon quote |
750-830 |
7.5-8.3 |
430-510 |
5.5-6.4 |
550-670 |
7.0-8.5 |
98-112 |
12.4-14.0 |
5.8-6.4 |
Compressed molding |
12.6 |
52 |
5.3 |
10,800 |
1,100 |
54 |
5.5 |
-0.05--0.07 |
Click on the part number for more information about each product
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Reviews shown here are reviews of companies.