Product
Equel SMFEN Bond magnet Nitroquench-PHandling Company
Daido ElectronicsItems marked with have different values depending on the model number.
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Product Image | Part Number | Price (excluding tax) | BR temperature coefficient α%/℃ | Bending elasticity (JISK7171) (KGF/mm²) | Bending elasticity (JISK7171) MPA | Bending strength (JISK7171) (kgf/mm²) | Bending strength (JISK7171) MPA | Density (g/cm³) | Heat expansion coefficient (JISK7179) (30-100 ° C) 10⁻⁶/℃ | Magnetic force, HCB (KA/M) | Magnetic force, HCB (KOE) | Magnetic force, HCJ (KA/M) | Magnetic force, HCJ (KOE) | Maximum energy (BH) MAX (MGOE) | Maximum energy (BH) MAX (kj/m³) | Molding method molding method | Pressure ring intensity (JISZ2507) MPA | Pressure ring intensity (jisz2507) (kgf/mm²) | Remaining magnetic flux density, BR (MT) | Residual magnetic flux density, br (kg) |
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SP-14 |
Available upon quote | -0.05--0.07 | 1,100 | 10,800 | 5.3 | 52 | 5.8-6.4 | 12.6 | 450-520 | 5.7-6.5 | 670-800 | 8.5-10.0 | 12.4-14.0 | 98-112 | Compressed molding | 54 | 5.5 | 750-820 | 7.5-8.2 | |
SP-14L |
Available upon quote | -0.05--0.07 | 1,100 | 10,800 | 5.3 | 52 | 5.8-6.4 | 12.6 | 430-510 | 5.5-6.4 | 550-670 | 7.0-8.5 | 12.4-14.0 | 98-112 | Compressed molding | 54 | 5.5 | 750-830 | 7.5-8.3 |
Click on the part number for more information about each product