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Compact sputtering equipment for research and development FDS/FRS Series-FDS/FRS Series
Compact sputtering equipment for research and development FDS/FRS Series-FKD Factory Co., Ltd.

Compact sputtering equipment for research and development FDS/FRS Series
FKD Factory Co., Ltd.


About This Product

Basic specifications: DC1 source sputtering

■Extension options

・Addition of 2-source magnetron cathode ・High vacuum specification (turbo molecular pump added) ・Reactive sputtering specification (mass flow controller added) ・RF sputtering specifications (RF power supply: auto matching added)

  • Product

    Compact sputtering equipment for research and development FDS/FRS Series

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1 Models of Compact sputtering equipment for research and development FDS/FRS Series

Image Part Number Price (excluding tax) High vacuum specification (turbo molecular pump added) vacuum gauge High vacuum specification (turbo molecular pump added) Pumping speed High vacuum specification (turbo molecular pump added) model High vacuum specification (turbo molecular pump added) Ultimate pressure High vacuum specification (turbo molecular pump added) Gas pressure adjustment Sample size Installation type Vacuum gauge Vacuum exhaust system External dimensions Addition of reactive sputtering specifications Flow rate Addition of reactive sputtering specifications Model number Added reactive sputtering specifications Gas type Power supply used Spare port Target Sputter power supply Sputter method Gas flow adjustment Gas introduction Cathode Added RF sputter specifications Oscillation frequency RF sputtering specifications added Model number Addition of 2-source magnetron cathode model 2-source specification magnetron cathode addition specifications
Compact sputtering equipment for research and development FDS/FRS Series-Part Number-FDS/FRS Series

FDS/FRS Series

Available upon quote

Full range gauge

35L/s

OS-HVS

≦5×10-4Pa

Butterfly valve

Maximum Φ2 inch/Small sample size possible

Tabletop type

Pirani Gauge/5.0×10^-2Pa~1.0×10^5Pa

Rotary pump 162L/min

W480×D510×H440mm *Protrusions not included

5sccm

OS-AGS

O2 or N2

AC100V/15A 1 system

NW40×2

Au/Ag/Pt/Pd/Ni/Cu/W/Cr/Ti/Ta/Mo/etc.

DC500V/0.8A

DC magnetron sputtering/depot up

MFC/20sccm for argon

1/4 inch Swagelok

Φ2 inch/magnetron cathode

13.56MHz

OS-RFS

OS-2CS

Two-source sputtering

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