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  4. Inspection and measurement equipment bare chip CI200D/CI300D (YASUNAGA CORPORATION)
Inspection and measurement equipment bare chip CI200D/CI300D-CI200D
Inspection and measurement equipment bare chip CI200D/CI300D-YASUNAGA CORPORATION

Inspection and measurement equipment bare chip CI200D/CI300D
YASUNAGA CORPORATION

YASUNAGA CORPORATION's Response Status

Response Rate

100.0%

Response Time

24.6hours

Relatively Fast Response

About This Product

■We propose optimal solutions for automation and labor saving.

Yasunaga's machinery equipment business began with processing machines for sewing machine arm beds, and for over half a century we have delivered many types of equipment, including drilling, cutting, assembly, and inspection, to the automobile, semiconductor, and electronic component fields. . In the new era of carbon neutrality, we pursue what mechanical equipment can do, and offer optimal solutions to our customers' various needs with a diverse lineup ranging from standard machines to customized machines.

■Solving manufacturing issues with unique inspection and measurement technology

We offer a lineup of visual inspection systems for various electronic components and automotive components that require strict quality control, including semiconductor IC package visual inspection systems that have the top market share in Japan. Utilizing our extensive experience and know-how in 2D/3D measurement and various defect inspections, we will make optimal proposals for considering optical environments and algorithm development according to the customer's workpiece.

■Customized production of visual inspection equipment for motorized areas such as motors and batteries

We can custom manufacture visual inspection equipment for motors, fuel cells, secondary batteries, solar cells, etc. We build the optimal environment for each part. In addition, we can provide specialized support according to product handling and pre- and post-processing.

■Customization available

We support various forms of customization such as transportation mode, inspection environment, and cooperation with the factory's host host. We can handle a wide range of orders from semi-custom to fully custom-made.

■Sample test

At AI GAKEN LABO, we accept sample tests for various workpieces to be inspected. From considering and constructing an optical environment suitable for the workpiece to developing dedicated algorithms, we will make the best proposal for the workpiece you are inspecting. Please feel free to contact us.

■High-accuracy and high-speed inspection of each wafer after dicing

This is an appearance inspection device for semiconductor bare chip parts with a dicing frame attached. Compatible with dicing frame transportation and highly accurate appearance inspection. We have a lineup of Φ200mm wafer and Φ300mm wafer types.

  • Product

    Inspection and measurement equipment bare chip CI200D/CI300D

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2 Models of Inspection and measurement equipment bare chip CI200D/CI300D

Click on the part number for more information about each product

Image Part Number Price (excluding tax) Target work
Inspection and measurement equipment bare chip CI200D/CI300D-Part Number-CI200D

CI200D

Available upon quote

Power devices, image sensors, optical communication devices, etc.

Inspection and measurement equipment bare chip CI200D/CI300D-Part Number-CI300D

CI300D

Available upon quote

Power devices, image sensors, optical communication devices, etc.

Click on the part number for more information about each product

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About Company Handling This Product

YASUNAGA CORPORATION

Response Rate

100.0%

Response Time

24.6hrs

Company Overview

Yasunaga Corporation, founded in 1923 and based in Iga City, Mie Prefecture, Japan, is a manufacturer of engin...

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Semiconductor inspection equipment
Semiconductor inspection equipment　YASUNAGA CORPORATION
YASUNAGA CORPORATION

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