Inspection and measurement equipment bare chip CI200D/CI300D
YASUNAGA CORPORATION
About This Product
■We propose optimal solutions for automation and labor saving.
Yasunaga's machinery equipment business began with processing machines for sewing machine arm beds, and for over half a century we have delivered many types of equipment, including drilling, cutting, assembly, and inspection, to the automobile, semiconductor, and electronic component fields. . In the new era of carbon neutrality, we pursue what mechanical equipment can do, and offer optimal solutions to our customers' various needs with a diverse lineup ranging from standard machines to customized machines.
■Solving manufacturing issues with unique inspection and measurement technology
We offer a lineup of visual inspection systems for various electronic components and automotive components that require strict quality control, including semiconductor IC package visual inspection systems that have the top market share in Japan. Utilizing our extensive experience and know-how in 2D/3D measurement and various defect inspections, we will make optimal proposals for considering optical environments and algorithm development according to the customer's workpiece.
■Customized production of visual inspection equipment for motorized areas such as motors and batteries
We can custom manufacture visual inspection equipment for motors, fuel cells, secondary batteries, solar cells, etc. We build the optimal environment for each part. In addition, we can provide specialized support according to product handling and pre- and post-processing.
■Customization available
We support various forms of customization such as transportation mode, inspection environment, and cooperation with the factory's host host. We can handle a wide range of orders from semi-custom to fully custom-made.
■Sample test
At AI GAKEN LABO, we accept sample tests for various workpieces to be inspected. From considering and constructing an optical environment suitable for the workpiece to developing dedicated algorithms, we will make the best proposal for the workpiece you are inspecting. Please feel free to contact us.
■High-accuracy and high-speed inspection of each wafer after dicing
This is an appearance inspection device for semiconductor bare chip parts with a dicing frame attached. Compatible with dicing frame transportation and highly accurate appearance inspection. We have a lineup of Φ200mm wafer and Φ300mm wafer types.
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Product
Inspection and measurement equipment bare chip CI200D/CI300D
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Handling Company
YASUNAGA CORPORATION
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Categories
2 Models of Inspection and measurement equipment bare chip CI200D/CI300D
Items marked with have different values depending on the model number.
Click on the part number for more information about each product
| Product Image | Part Number | Price (excluding tax) | Target work |
|---|---|---|---|
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CI200D |
Available upon quote | Power devices, image sensors, optical communication devices, etc. |
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CI300D |
Available upon quote | Power devices, image sensors, optical communication devices, etc. |
Click on the part number for more information about each product
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About Company Handling This Product
- Japan