Sirius RF-T, high-speed XRR & XRF measurement device for evaluating metal film thickness and composition of patterned wafers
Bruker Corporation
About This Product
■High-speed XRP&XRF measurement for metal film thickness and composition evaluation of patterned wafers
The Bruker Sirius RF-T is the successor to the JVX 7300RF-T, which is already used in many fabs around the world, and is a multi-channel measurement platform that combines micro-spot XRF and patented high-speed, micro-XRR. By combining pattern recognition, it is possible to measure on minute pads and scribe lines.
XRF can measure film thickness using a calibration curve and perform composition analysis using a calibration curve, making it possible to measure a wide range of film thicknesses from very thin films to films as thick as 1 μm. XRR can perform absolute film thickness measurements, and with its unique optical system, measurements can be completed in a few seconds per point. The advanced automatic stabilization mechanism is designed to minimize the burden on the user such as redrawing the calibration curve.
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Product
Sirius RF-T, high-speed XRR & XRF measurement device for evaluating metal film thickness and composition of patterned wafers
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Handling Company
Bruker Corporation
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Categories
1 Models of Sirius RF-T, high-speed XRR & XRF measurement device for evaluating metal film thickness and composition of patterned wafers
| Product Image | Part Number | Price (excluding tax) |
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Sirius RF |
Available upon quote |
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About Company Handling This Product
- United States of America