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  4. X-ray topography device JV QC-TT that detects crystal defects in wafers (Bruker Corporation)
X-ray topography device JV QC-TT that detects crystal defects in wafers-JV QC-TT
X-ray topography device JV QC-TT that detects crystal defects in wafers-Bruker Corporation

X-ray topography device JV QC-TT that detects crystal defects in wafers
Bruker Corporation

Bruker Corporation's Response Status

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30.7hours

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About This Product

■Crystal defect visualization device/X-ray topography

The Bruker JV QCTT instrument is a comprehensive solution that provides crystal defect inspection using X-ray diffraction imaging (XRDI) technology. Using this technology, it is possible to visualize the location and size of minute cracks, slips, and crystal defects inside the wafer crystal. Since it is different from optical technology, there is no need for preliminary processing such as etching or polishing before measurement, and it can be inspected non-destructively. In SiC substrates, the density and distribution of crystal defects can be investigated in place of conventional KOH etching, and it is possible to investigate the density and distribution of crystal defects, such as threading edge dislocations (TED), threading screw dislocations (TSD), and basal plane dislocations. plane dislocation (BPD) defects can be automatically classified and defect density can be measured non-destructively. An automatic wafer handling robot (optional) allows inspection to be performed automatically as part of the measurement process.

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    X-ray topography device JV QC-TT that detects crystal defects in wafers

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1 Models of X-ray topography device JV QC-TT that detects crystal defects in wafers

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X-ray topography device JV QC-TT that detects crystal defects in wafers-Part Number-JV QC-TT

JV QC-TT

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Bruker Corporation

Response Rate

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Response Time

30.7hrs

Company Overview

Bruker, founded in 1960 and based in Billerica, Massachusetts, is a manufacturer and distributor of scientific...

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