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  4. Convenient open loading provides a versatile ICP etch solution PlasmaPro 80 ICP RIE (Oxford Instruments Ltd.)
Convenient open loading provides a versatile ICP etch solution PlasmaPro 80 ICP RIE-PlasmaPro 80 ICP RIE
Convenient open loading provides a versatile ICP etch solution PlasmaPro 80 ICP RIE-Oxford Instruments Ltd.

Convenient open loading provides a versatile ICP etch solution PlasmaPro 80 ICP RIE
Oxford Instruments Ltd.

About This Product

■Summary

The PlasmaPro 80 ICP RIE is a system that provides a versatile ICP etch solution with a compact, small footprint and convenient open loading. - Easy to install and use, without compromising process quality. - Open load design allows for quick loading and unloading of wafers, making it ideal for research, prototyping, and low-volume production. - Optimized electrode cooling function and excellent substrate temperature control realize high-performance processes.

■Features

・Open load design allows for quick loading and unloading of wafers ・Excellent etching control and optimal etching speed setting ・Achieves excellent wafer temperature uniformity ・Can process wafers up to 200mm ・Low cost of ownership ・Compliant with safety guidelines Semi S2/S8

■System features

・Compact: Easy to install ・Optimized electrode cooling function: substrate temperature control ・Uses a high-conductance radial (axisymmetric) pump: Improves process uniformity and increases etching speed ・Data logger function of 500ms or less: Traceability and history of chamber and process conditions can be recorded. ・Close coupling turbo pump: high pump speed and excellent base pressure ・Clear accessibility to major parts: improved serviceability and maintainability ・X20 Control System: Significantly improves data searchability and achieves faster and more reproducible matching ・Front-end software-based fault diagnosis and tool diagnosis: Rapid fault diagnosis - Laser endpoint detection using interferometers - measuring the etching depth of transparent materials on reflective surfaces (e.g. oxides on Si) or determining layer boundaries by measuring the reflectance of non-transparent materials (e.g. metals) ・Optical emission spectroscopy (OES) for endpoint measurements in large sample volumes or batch processes: detects changes in etching byproducts and depletion of reactive gas species, and is used for endpoint measurements in chamber cleaning

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    Convenient open loading provides a versatile ICP etch solution PlasmaPro 80 ICP RIE

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1 Models of Convenient open loading provides a versatile ICP etch solution PlasmaPro 80 ICP RIE

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Convenient open loading provides a versatile ICP etch solution PlasmaPro 80 ICP RIE-Part Number-PlasmaPro 80 ICP RIE

PlasmaPro 80 ICP RIE

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