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  3. Printed Circuit Boards (PCB)
  4. Build -up method is also possible in addition to normal laminating methods, multilayer FPC Fine pitch specifications (Maruwa Seisakusho Co., Ltd.)

Build -up method is also possible in addition to normal laminating methods, multilayer FPC Fine pitch specifications
Maruwa Seisakusho Co., Ltd.

About This Product

■ Overview

The conductor is a print wiring board with three or more layers. Build -up methods are also possible besides normal laminate construction. 　　　　　

■ Product example

High -density, high -speed signal application

■ What is FPC?

A structure with a conductor on a thin plastic insulating film is called a flexible substrate (FPC).

■ FPC usage use

As demand for high -performance and high -density of light -powered devices increases, the demand for flexible printing wiring (FPC) is increasing. The FPC is thin and can be folded freely, is extremely lightweight, and can be used effectively. The Maruwa Works will apply the unique technology cultivated in -house to meet the needs of our customers.

  • Product

    Build -up method is also possible in addition to normal laminating methods, multilayer FPC Fine pitch specifications

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0 Models of Build -up method is also possible in addition to normal laminating methods, multilayer FPC Fine pitch specifications

Image Part Number Price (excluding tax) Copper thick (μm) Pitch (μm) Small L/S (μm) Applicable FCCL

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Maruwa Seisakusho Co., Ltd.

  • Japan

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