Simple technical molecular molecular joint lab that strongly joins at the molecular level
Maruwa Seisakusho Co., Ltd.
About This Product
■ Characteristics
・ Simple technology that strongly joins at a molecular level that is completely different from the conventional adhesion and joining concept
・ Secure adhesion even at smooth interface
■ Process innovation
・ Materials, shortening processes
·Quality improvement
·lowering cost
・ Environmental harmony
■ Product hynovation
・ Thin and lighter weight, high density
・ Improvement of reliability
・ Improvement of low heat resistance and high frequency characteristics
・ Value that cannot be done with conventional bonding technology
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Product
Simple technical molecular molecular joint lab that strongly joins at the molecular level
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Handling Company
Maruwa Seisakusho Co., Ltd.
3 Models of Simple technical molecular molecular joint lab that strongly joins at the molecular level
Items marked with have different values depending on the model number.
Click on the part number for more information about each product
| Product Image | Part Number | Price (excluding tax) | Customer value process | Customer value product |
|---|---|---|---|---|
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Thermoelectric solution |
Available upon quote |
・ Materials, shortening processes ·lowering cost ・ Reduction of capital investment ・ Reduction of environmental load |
・ Thin, lighter ・ High -definition pattern formation ・ Transmission loss proposal ・ High reliability |
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Resin adhesion |
Available upon quote |
・ Materials, shortening processes ·lowering cost |
・ Thin, lighter ・ Reduction of transmission loss ・ High reliability |
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Joining together |
Available upon quote |
・ Materials, shortening processes ·lowering cost |
・ Thin, lighter ・ Environmental resistance ・ High reliability ・ Reduction of contact heat resistance |
Click on the part number for more information about each product
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About Company Handling This Product
- Japan
- Since 2009
- 70 employees