Build -up method is also possible in addition to normal laminating methods, multilayer FPC Fine pitch specifications
Maruwa Seisakusho Co., Ltd.
About This Product
■ Overview
The conductor is a print wiring board with three or more layers. Build -up methods are also possible besides normal laminate construction.
■ Product example
High -density, high -speed signal application
■ What is FPC?
A structure with a conductor on a thin plastic insulating film is called a flexible substrate (FPC).
■ FPC usage use
As demand for high -performance and high -density of light -powered devices increases, the demand for flexible printing wiring (FPC) is increasing. The FPC is thin and can be folded freely, is extremely lightweight, and can be used effectively. The Maruwa Works will apply the unique technology cultivated in -house to meet the needs of our customers.
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Product
Build -up method is also possible in addition to normal laminating methods, multilayer FPC Fine pitch specifications
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Handling Company
Maruwa Seisakusho Co., Ltd.
2 Models of Build -up method is also possible in addition to normal laminating methods, multilayer FPC Fine pitch specifications
Items marked with have different values depending on the model number.
Click on the part number for more information about each product
| Product Image | Part Number | Price (excluding tax) | Applicable FCCL | Copper thick (μm) | Pitch (μm) | Small L/S (μm) |
|---|---|---|---|---|---|---|
Multi -layer FPC Fine pitch specification 120 pitch (mass production) |
Available upon quote | Spatta 2 layers | 8 | 120 | 60/60 | |
Multi -layer FPC Fine pitch specification 80 pitch (prototype) |
Available upon quote | Spatta 2 layers | 8 | 80 | 40/40 |
Click on the part number for more information about each product
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About Company Handling This Product
- Japan
- Since 2009
- 70 employees