More molded molded molding with resin
ROHM MECHATECH
About This Product
■ Realize the package mirror finish of 0.5 μRz
The mold -type surface used for semiconductor packaging requires an ascetic surface that is as close as possible to the mirror surface. By EDM processing, we have realized a mirror surface of 0.5 μRz (0.7 μRY) of the semiconductor package part 30mm square.
■ Rohm Mecatech's technology used in state -of -the -art digital devices
Rohm Mecatech's technology is used in state -of -the -art digital devices such as mobile phones, digital cameras, DVD players, cars, and medical care.
■ Characteristics
・ A mold for molding the shape of the product with resin.
・ It is widely used for packaging such as LSI, transistor, and diode lead frames.
■ Semiconductor / electronic parts that are born from molding funds
・ Monolisic IC
・ Transistor
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Product
More molded molded molding with resin
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Handling Company
ROHM MECHATECH
1 Models of More molded molded molding with resin
| Product Image | Part Number | Price (excluding tax) |
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Mold mold |
Available upon quote |
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