Compatible semiconductor package molds for a wide range of applications
ROHM MECHATECH
About This Product
■ Realize the package mirror finish of 0.5 μRz
The mold -type surface used for semiconductor packaging requires an ascetic surface that is as close as possible to the mirror surface. By EDM processing, we have realized a mirror surface of 0.5 μRz (0.7 μRY) of the semiconductor package part 30mm square.
■ Rohm Mecatech's technology used in state -of -the -art digital devices
Rohm Mecatech's technology is used in state -of -the -art digital devices such as mobile phones, digital cameras, DVD players, cars, and medical care.
■ Characteristics
Precisely designed semiconductor. The mold for semiconductor manufacturing that rates the package requires high accuracy above all. For that reason, ROHM Mecotec focuses on technology development on accuracy. Excellent originality and practicality are highly evaluated in the industry.
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Product
Compatible semiconductor package molds for a wide range of applications
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Handling Company
ROHM MECHATECH
1 Models of Compatible semiconductor package molds for a wide range of applications
| Product Image | Part Number | Price (excluding tax) |
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Semiconductor package mold |
Available upon quote |
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