Compatible with small shapes and complex bending shapes trim forming molds
ROHM MECHATECH
About This Product
■ Realize the package mirror finish of 0.5 μRz
The mold -type surface used for semiconductor packaging requires an ascetic surface that is as close as possible to the mirror surface. By EDM processing, we have realized a mirror surface of 0.5 μRz (0.7 μRY) of the semiconductor package part 30mm square.
■ Rohm Mecatech's technology used in state -of -the -art digital devices
Rohm Mecatech's technology is used in state -of -the -art digital devices such as mobile phones, digital cameras, DVD players, cars, and medical care.
■ Characteristics
A mold for lead processing and is used for lead cuts such as LSI and transistor and lead forming. It supports small shapes and complicated bending shapes.
■ Semiconductor / electronic components born from trim forming molds
Lead cut forming
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Product
Compatible with small shapes and complex bending shapes trim forming molds
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Handling Company
ROHM MECHATECH
1 Models of Compatible with small shapes and complex bending shapes trim forming molds
| Product Image | Part Number | Price (excluding tax) |
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Trim forming mold |
Available upon quote |
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