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Compatible with small shapes and complex bending shapes trim forming molds-Trim forming mold
Compatible with small shapes and complex bending shapes trim forming molds-ROHM MECHATECH

Compatible with small shapes and complex bending shapes trim forming molds
ROHM MECHATECH


About This Product

■ Realize the package mirror finish of 0.5 μRz

The mold -type surface used for semiconductor packaging requires an ascetic surface that is as close as possible to the mirror surface. By EDM processing, we have realized a mirror surface of 0.5 μRz (0.7 μRY) of the semiconductor package part 30mm square.

■ Rohm Mecatech's technology used in state -of -the -art digital devices

Rohm Mecatech's technology is used in state -of -the -art digital devices such as mobile phones, digital cameras, DVD players, cars, and medical care.

■ Characteristics

A mold for lead processing and is used for lead cuts such as LSI and transistor and lead forming. It supports small shapes and complicated bending shapes.

■ Semiconductor / electronic components born from trim forming molds

Lead cut forming

  • Product

    Compatible with small shapes and complex bending shapes trim forming molds

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