Compatible with small shapes and complex bending shapes trim forming molds (ROHM MECHATECH)
Compatible with small shapes and complex bending shapes trim forming molds
ROHM MECHATECH
This product is registered by ROHM MECHATECH.
About This Product
■ Realize the package mirror finish of 0.5 μRz
The mold -type surface used for semiconductor packaging requires an ascetic surface that is as close as possible to the mirror surface. By EDM processing, we have realized a mirror surface of 0.5 μRz (0.7 μRY) of the semiconductor package part 30mm square.
■ Rohm Mecatech's technology used in state -of -the -art digital devices
Rohm Mecatech's technology is used in state -of -the -art digital devices such as mobile phones, digital cameras, DVD players, cars, and medical care.
■ Characteristics
A mold for lead processing and is used for lead cuts such as LSI and transistor and lead forming. It supports small shapes and complicated bending shapes.
■ Semiconductor / electronic components born from trim forming molds
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